Cadence is aiming at high-end PCBs and motherboards with a 3D electromagnetic modelling package called Clarity 3D Solver. It is intended particularly at the fastest parallel and serial links, such as DDR4 and 112Gbit/s – the latter achieved using PAM4 four-voltage-level signalling. “Chips are getting much faster,” Cadence product director Brad Griffin told Electronics Weekly. “There are no shortcuts with 112G ...
EDA and IP
Huawei tops WIPO filings
Huawei made more patent applications to the World Intellectual Property Organization (WIPO) last year, than any other organisation. In fact Huawei holds the all-time record for patent applications to WIPO in any one year. “It’s an all-time record by anyone,” says WIPO director general Francis Gurry. Huawei made 5,405 patent applications to WIPO in 2018, up from 4,024 in 2017. Just ...
Cadence ups DSP throughput for 5G comms, and automotive radar and lidar
Cadence has extended the pipeline within its ConnX DSP IP family
Arm adds neural networking instructions to Cortex-M
Arm has added neural network processing instructions to its Cortex-M architecture, aiming at products at the outside edge of IoT networks, such as devices that can recognise a few spoken words without connecting to the cloud – vocal wake commands for example. The ‘M-Profile Vector Extensions’ (MVEs) have been announced under the brand ‘Helium’, and are loosely analogous to Neon ...
Power module firm launches thermal design tool for its products
Power module firm Flex has added thermal simulation to its Power Designer software. “The thermal model in the latest release, Flex Power Designer 3.0, enables designers to simulate thermal behaviours in their power system designs. For example, this makes it possible to calculate hot spot temperature and overall system efficiency,” according to the firm. Designers can specify board properties including ...
A view from the RISC-V Summit
The RISC-V Summit was held in Santa Clara, California, USA this week (3 – 6 December). The industry looked ahead to the potential of the open architecture and was a platform for the providers of core IP and development tools that make up its ecosystem. There were two announcements from IAR Systems in support of establishing a robust ecosystem for ...
Cadence ties with UK design house for 7nm
Moortec is a Plymouth-based intellectual property company, concentrating since 2010 in the specialist world of on-die self-monitoring circuits for customer SoCs – blocks that allow chip manufacturers to keep an eye on process variation, as well as providing feedback for operational dynamic frequency scaling and dynamic voltage scaling, and assessing silicon die aging. Starting with a 40nm temperature monitor in ...
Imagination re-works GPUs for latest Series9 offerings
Imagination Technologies has announced three Series9 PowerVR GPU series
DesignSpark Mechanical gets 3D print slicing in v4 upgraded
RS has added 3D print slicing as well as a ‘blend’ tool to its free DesignSpark Mechanical CAD package, raising it to Version 4.0. The slicing software – used to prepare files for layer-based 3D printing – is Ultimaker’s popular ‘Cura’, which is open-source. “This feature is the result of collaboration between RS and Ultimaker, one of the biggest 3D printing ...
Image compression technology to save power in the blink of an eye
Image compression technology in the PowerVR PVRIC4 IP block enables random access, visually lossless image compression for bandwidth and memory savings for DTVs, smartphones and tablets, says Imagination Technologies. Claimed to halve memory bandwidth and footprint, the IP block targets SoC development for consumer applications to meet the needs of the higher resolution demanded by 4K and 8K displays, as ...