James Eisenhaure has become CFO of Californian CEM Naprotek, having been interim CFO since earlier this year. “During his interim tenure, Eisenhaure played a key role in leading the company through the closeout of its FY2024 financial audit,” according to the company. “His leadership and collaboration across teams ensured a smooth and timely process.” Prior to this he has has leadership ...
Teledyne Space Imaging has had its second CCD launch within a week, this time in part of the European Space Agency’s Sentinel-4 space-based air-quality monitoring mission. In the other one, a pair of Teledyne CIS120 sensors launched on GOSAT-GW, Japan’s global observing satellite for greenhouse gases and water cycle satellite Sentinel-4 will be spread across multiple satellites, with this Sentinel-4 ...
Samsung is delaying facilitising its Taylor, Texas fab (pictured below) because it lacks customers for it, reports the Nikkei. The success of TSMC’s 2nm process has been so comprehensive that the company has won many of the big customers for it – Apple, MediaTek, Qualcomm, AMD and Broadcom. Earlier this week it was reported that Intel is considering giving up ...
X-Fab has improved 25V isolation for better SPAD integration in its 180nm XH018 fab process. 4×3 SPAD arrays: Original Isomos1 and new Isomos2 (right) SPADs – single-photon avalanche diodes – are used as optical receivers in lidar, 3D imaging, depth sensing and quantum communication. The improved isolation module, called Isomos2, improves pixel density and fill factor. “In a typical 4×3 ...
Hampshire-based Barnbrook Systems secured a “six-figure” contract for refurbishing over 100 of its brake controllers, which will be used on Class 15x engines operating across the UK. “Our first order for the brake controller was more than a decade ago when we re-engineered an original model which was out of service and no longer commercially available,” said Barnbrook MD Andrew ...
SolderKing Assembly Materials met the King at a reception at Windsor Castle, following the company’s King’s Award for Enterprise in International Trade. “Meeting His Majesty The King at Windsor Castle was an honour that reflects the dedication of our entire team,” said COO Chris Ward. “This recognition validates our commitment to delivering British-manufactured soldering solutions to the international electronics industry.” ...
Soitec, the French wafer manufacturer, has announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at the wafer level. This marks the first public announcement of Soitec’s TLT technology. The technology is an enabler ...
TSMC is looking at the possibility of building six fabs in the UAE, reports Bloomberg. Last September the Wall Street Journal reported that both TSMC and Samsung had visited the UAE to talk about building fabs there. Talks with the Biden administration about the plan broke down when the US government said it would need assurances that the US would ...
Siemens Digital Industries Software and Intel Foundry have announced tool certifications. Siemens’ Calibre nmPlatform tool is now certified for the Intel 18A PDK. Siemens’ Solido SPICE and Analog FastSPICE (AFS) software tools have been certified for the Intel 18A PDK. Siemens’ Calibre nmPlatform and its Analog FastSPICE (AFS) software, which is part of Siemens’ Solido Simulation Suite offerings, are also ...
Hybrid bonding offers advantages over ‘bump-based’ interconnects, but high yield production relies on inspection. By Hari Polu. Hybrid bonding is quickly gaining recognition due to the enhanced reliability and mechanical strength of its interconnects, as well as the space savings compared to traditional bump-based interconnections. This bonding technique vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the ...
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