Manufacturing

ROHM and TSMC have entered a strategic partnership on development and volume production of GaN power devices for electric vehicle applications. The partnership will integrate ROHM’s device development technology with TSMC’s GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon for power devices. GaN power devices are currently used in consumer and industrial ...

EMS provider Escatec has integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes. The company has built a customised UV-curing system with two 365nm light sources on the die bond head of their Tresky T6000 fully automatic machine. This enables exact positioning of components and direct snap-curing required during the ...

The US government has announced a Notice of Funding Opportunity (NOFO) for activities that will use AI and autonomous experimentation (AE) technologies to support the long-term viability of next-generation semiconductor manufacturing. The CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) funding opportunity will be critical in meeting the industry’s technology, economic, and sustainability goals. On November 8, ...

Chinese foundries are set to be the main drivers of  an increase of 6% in the capacity of the world’s top ten mature process foundries, according to TrendForce. For mature nodes – 28 nm and above – average capacity utilisation increased by 5% to 10% in H2 compared to H1 and is forecast to climb to 75% next year, Major ...

The yield on TSMC’s  4nm process being ramped at its first Phoenix, Arizona fab is 4% better than the yields from its Taiwan fabs, according to Rick Cassidy, president of TSMC’s US division. Volume production in Arizona is expected to start early next year. Originally it was planned for this year after construction started in 2021, but delays caused by ...

German auto parts supplier ZF Friedrichshafen is pulling out of its Saarland fab jv with Wolfspeed, reports Handelsbatt, citing weak demand from EV makers. Wolfspeed had originally planned to build a $3 billion fab to start running silicon in 2027 plus an R&D Centre in Saarland with ZF paying $185 million for a stake in the project. The EU had ...

Murata has opened a 200mm silicon capacitor manufacturing line at the French campus it acquired with IPDiA in 2016. “With the launch of this new line, we are continuing to invest in growing our production facilities and our local workforce,” said Murata Manufacturing president Norio Nakajima (picured). “It represents a significant step forward in our growth in the sector and ...

GE Vernova is to expand its existing manufacturing facilities in Stafford, UK. The expansion is aimed at supporting the fast-growing demand for HVDC transmission systems that will help power renewable energy projects throughout Europe, Asia and North America, while also supporting the UK’s energy transition. The expansion focuses on two key sites of its Electrification Systems’ Grid Solutions business in ...

Intel’s 18A has been found wanting by Broadcom after it ran test wafers on the process, reports Reuters. According to the report, Broadcom got the wafers back from Intel last month and decided that the process was not yet viable for high volume production. “Intel 18A is powered on, healthy and yielding well, and we remain fully on track to ...

ESMC – a jv between TSMC, Bosch, Infineon and NXP – broke ground for its first fab in Dresden yesterday, with the EU announcing it had approved a €5 billion subsidy from the German government for the €10 billion project. ”Together with our partners, Bosch, Infineon and NXP, we are building our Dresden facility to meet the semiconductor needs of ...