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Manufacturing

Q4 good for advanced foundry nodes; bad for mature nodes

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Advanced foundry process nodes had 10% q-o-q Q4 growth with demand from AI servers, smartphone processors and PCs driving the top ten foundries to revenues of $38.48 billion. However, mature nodes saw a slowdown in growth . TSMC boosted revenue to $26.85 billion for a 67% market share. Samsung Foundry ranked second, with revenue declining 1.4% QoQ to $3.26 billion, ...

Ams Osram wins Chips Act funding for Austrian manufacturing facility

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Ams Osram has received EU Commission approval for funding to develop a new semiconductor manufacturing facility in Austria. The investment grant – under the European Chips Act – is up to the value of €227 million. The proposed fab, on its Premstätten existing site, will produce next-generation optoelectronic sensors, said the company. In total, the company plans to invest €567 ...

Würth finalises closes Schopfheim PCB factory closure

Wurth closes Schopfheim PCB fab

Würth Elektronik Circuit Board Technology has finalised plans to close its Schopfheim PCB production site in Switzerland, first announced in October. “The management and works council have now reached an agreement on a reconciliation of interests and a social plan, which was presented to the affected employees at a works meeting on Thursday, February 6, 2025,” according to the company. ...

Xaar sells coating technology to Chinese EV battery companies

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Cambridge-based specialist print head maker Xaar has signed-up two Chinese electric vehicle battery companies for its surface-coating technology. “Our work with Omijia and Shifang highlights Xaar’s commitment to advancing the EV industry by addressing critical challenges in battery manufacturing,” said Xaar CEO John Mills (both photos). Xaar is aiming at replacing traditional coating methods such as PET film with inks ...

Intel’s process tech catch-up looks unlikely

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Intel’s hopes of overtaking TSMC in process technology this year or next year have taken a knock after a TSMC statement about its A16 process from CEO C.C.Wei that: “Volume production is scheduled for second half 2026.” Meanwhile, rumours are resurrected about a takeover. Intel hopes to start to ramp its 18A process at its Oregon development fab in H2 ...

GloFo to build New York packaging facility

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GlobalFoundries is to create a new centre for advanced packaging and test at its New York fab site which is expected to offer: Advanced packaging, assembly and testing for GF’s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power efficiencies and performance advantages. Full turnkey advanced packaging, bump, assembly and testing ...

Your own High-NA EUV machine for €208

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ASML is used to having customers clamouring for its the photography machines during chip booms when supply is tight but sales of its latest offering is being restricted by the company’s own choice. A Lego model (pictured above) of ASML’s $350 million High-NA EUV machine is on sale in the company store for €208. Despite  widespread interest in obtaining a ...

POET engages Globetronics for photonics sub-contract manufacturing

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POET Technologies, the Toronto designer and developer of the POET Optical Interposer, Photonic Integrated Circuits (PICs) and light sources,  has engaged Globetronics Manufacturing Sdn Bhd (GMSB) to manufacture optical engines in Penang, Malaysia. GMSB will assemble and test Optical Engines for POET based on designs made by POET. A suite of wafer-level process equipment recently purchased by POET is being ...

X-FAB upgrades its SiC process

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X-FAB Silicon Foundries, the analogue/mixed-signal specialty foundry, has upgraded its XbloX platform, advancing SiC process technology for power MOSFETs, delivering reduced cell pitch, enabling increased die per wafer and improving on-state resistance without compromising reliability. The new process, XSICM03, is now available for early access. “With its streamlined approach, our process addresses the increasing demand for high-performance SiC devices in ...

Sponsored Content: How the FUNMAT PRO 310 NEO Strengthens Semiconductor Equipment Manufacturer’s Competitive

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As advancements in AI, autonomous driving, and Web3.0 fuel demand for high-performance computing, the high-end semiconductor industry is experiencing rapid growth. In this landscape, INTAMSYS, a leading player in FFF 3D printing sector, has become a trusted partner for high-tech manufacturers, known for its strong technical expertise and dedication to innovation. One such collaboration with ASMPT, a global leader in ...