Ams Osram wins Chips Act funding for Austrian manufacturing facility

Ams Osram has received EU Commission approval for funding to develop a new semiconductor manufacturing facility in Austria. The investment grant – under the European Chips Act – is up to the value of €227 million.

The proposed fab, on its Premstätten existing site, will produce next-generation optoelectronic sensors, said the company.

In total, the company plans to invest €567 million in the project by 2030, which is when full production is due to begin. The Austrian government is also contributing funding.

Chips Act

“We are pleased that the European Commission has approved Austrian state aid under the European Chips Act to expand our semiconductor manufacturing in Premstätten,” said Aldo Kamper, company CEO. “The financing is part of Ams Osram’s important investments in Austria in new generations of innovative microchips for medical and automotive applications.”

“The first fab of its kind for next-generation optoelectronic sensors is a key cornerstone of our growth strategy. In line with the objectives set out in the European Chips Act, it will strengthen Europe’s security of supply and technological autonomy in the field of semiconductor technologies. We are grateful for the support we have received from both the Austrian government and the European Commission.”

Optoelectronic sensors

The facility will produce highly differentiated optoelectronic sensors qualified for applications in medical technology and the automotive industry.

There are also expectations for products for industrial or consumer goods use.

According to Ams Osram, it will be combining CMOS, TSV (Through Silicon Vias) and filter technologies:

“Depending on the product, the different capabilities can be combined individually as required for energy-efficient products for imaging and optoelectronics with a reduced form factor, more functions on a single component and outstanding electrical performance. The construction of the additional cleanroom at the Premstätten site, with an area of 1,800 square meters for CMOS production, will also double filter capacity and increase TSV capacity by a factor of four.”