Sensors Converge: X-Fab processes tuned for SPADs

X-Fab has improved 25V isolation for better SPAD integration in its 180nm XH018 fab process.

Xfab XH018 4x3 SPAD pixel

4×3 SPAD arrays: Original Isomos1 and new Isomos2 (right)

SPADs – single-photon avalanche diodes – are used as optical receivers in lidar, 3D imaging, depth sensing and quantum communication.


The improved isolation module, called Isomos2, improves pixel density and fill factor.


“In a typical 4×3 SPAD array with 10 x 10µm2 optical areas, the adoption of the new isolation class enables around 25% reduction in total area and boosts fill factor by approximately 30% compared to the previously available isolation class,” according to the company. “With carefully optimized pixel design, even greater gains in area efficiency and detection sensitivity are achievable.”

Models and a process design kit are available.

Discuss the Isomos2 module with X-FAB on stand 847 at Sensors Converge 2025 in Santa Clara over 24 to 26 June.

In February, X-Fab’s XH018 process was used to demonstrate Attosemi novel testable one-time programmable memory

X-Fab has ~4,500 employees and six wafer fabs across Malaysia, Germany, France and the US, where it makes analogue, mixed-signal, mems, photonic, silicon carbide and gallium nitride devices.

Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.

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