X-FAB

X-Fab has improved 25V isolation for better SPAD integration in its 180nm XH018 fab process. 4×3 SPAD arrays: Original Isomos1 and new Isomos2 (right) SPADs – single-photon avalanche diodes – are used as optical receivers in lidar, 3D imaging, depth sensing and quantum communication. The improved isolation module, called Isomos2, improves pixel density and fill factor. “In a typical 4×3 ...

X-Fab has turned to Soitec wafers to offer silicon carbide foundry services from its fab in Lubbock Texas. The 150mm wafers, called ‘SmartSiC’, are made from a thin layer of mono-crystalline SiC, cut from a thick SiC donor wafer, bonded to a low-resistivity polycrystalline siclicon carbide ‘handle’ wafer – up to 10 thin mono-crystalline wafers can be cut from each ...

X-FAB Silicon Foundries SE, the analogue/mixed-signal and speciality foundry, has updated its XP018 high-voltage CMOS semiconductor fabrication platform with new 40V and 60V high-voltage primitive devices, which feature an extended SOA for improved operational robustness. These 2nd generation high-voltage primitive devices exhibit up to a 50% reduction in RDSon figures compared to the previous version. This offers an alternative which ...

X-FAB, the  analogue /mixed-signal and specialty foundry, is set to receive subsidies as part of the new Important Project of Common European Interest in Microelectronics and Communication Technologies (IPCEI ME/CT). The funding, totalling up to €80 million, is to be granted by France and Germany over a period of five years. The funding will cover three X-FAB sites, each focusing ...

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], so that high-density digital logic ...

X-Fab Silicon Foundries has added 375V power transistors to the devices available from its 180nm deep trench isolation BCD-on-SoI platform chip fab. The second generation of its XT018 super-junction high-voltage primitive devices, they cover 45 to 375V in one process module and are aimed at applications like medical ultrasound transmitter-receiver ICs and AC line-powered IoT sensors. The complementary nmos-pmos devices qualified ...

X-Fab and Ligentec have teamed up to offer “Europe’s largest capacity foundry service for integrated photonic circuits”, said X-Fab. In particular, they are talking about silicon nitride photonics, which Ligentech specialises in. “Silicon nitride offers superior performance to manage the light in the chip circuitry, with unprecedented low propagation losses and high-power handling,” said Ligentec co-founder Michael Zervas. “While there ...

Chip foundry X-Fab has announced a reference design kit for its XH018 180nm modular mixed-signal high-voltage CMOS process and Siemens’ Tanner analogue and mixed-signal (AMS) EDA software. “The kit is based on silicon-proven circuitry, providing coverage of the flow to design and simulate analogue and mixed-signal ICs,” according to X-Fab which “provides its customers reference design flows based on its established ...

X-Fab Silicon Foundries SE is offering SiC foundry services at the scale of silicon, running both processes on the same manufacturing line. The pure-play foundry has added internal SiC epitaxy capabilities to its offering, meaning more of the process chain is accessed through a single source.  The firm says growing demand has necessitated it expand SiC capacity, which has now ...

X-Fab Silicon Foundries SE has announced the availability of Sonos-based flash and embedded EEPROM on its XT018 BCD-on-SOI platform. The addition of these non-volatile memory elements will open up a broader array of applications where high-voltage ratings and resilience to elevated temperatures need to be coupled with enhanced computational capabilities. The EEPROM part is designed for use cases where memory ...