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Fabrication Semiconductors

Sensors Converge: X-Fab processes tuned for SPADs

Xfab XH018 4x3 SPAD pixel

X-Fab has improved 25V isolation for better SPAD integration in its 180nm XH018 fab process. 4×3 SPAD arrays: Original Isomos1 and new Isomos2 (right) SPADs – single-photon avalanche diodes – are used as optical receivers in lidar, 3D imaging, depth sensing and quantum communication. The improved isolation module, called Isomos2, improves pixel density and fill factor. “In a typical 4×3 ...

Imec reveals CO2 assessment tool for fabs

Imec-ITFZero

Belgian semiconductor research lab Imec has revealed an on-line tool that quantifies the environmental impact of IC manufacturing. Called imec.netzero, it is built on an in-house virtual model of a fab and its supply chain. “The tool provides valuable insights for academics, policy makers and designers,” according to Imec, which “aims to support industry in reducing its environmental impact, beyond ...

X-Fab offers 110nm BCD-on-SoI process

XFab XT011 110nm BCDonSoI

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], so that high-density digital logic ...

More on: Jet-powered submarine is <1mm across

TUChemnitz-micro-jet-sub

Chemnitz University of Technology has reported a steerable jet-powered micro-submarine, built using wafer processing techniques. Curious, Electronic Weekly got in touch with the team to find out more. A note on the diagram (right) – this is the best diagram of the basic structure we can get our hands on, although it is of a future concept rather than the ...