Electronics Weekly
- Advanced packaging, assembly and testing for GF’s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power efficiencies and performance advantages.
- Full turnkey advanced packaging, bump, assembly and testing for aerospace and defense customers under GF’s Trusted Foundry accreditation, allowing chips used in sensitive national security systems to never leave the U.S. during production.
- New production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and HI chips using GF’s 12LP+, 22FDX®, and other leading platforms.
GF’s overall investment in the centre is expected to be $575 million, with an additional $186 million investment in R&D over the next 10-plus years. It is expected to create approximately 100 new full-time GF jobs in New York over the next five years.
New York state will provide up to $20 million in new support in addition to the previously announced $550 million in support for GF from the New York State Green CHIPS program.
The U.S. Department of Commerce will provide up to $75 million in direct funding to support the center, supplementing the previously announced $1.5 billion GF award under the Chips and Science Act.
