EDA and IP

Siemens Digital Industries Software says its Solido SPICE simulation tool is now certified across Samsung Foundry’s FinFET and GAA fabrication processes, including the foundry’s 14LPU, 14LPP, 8LPP, 5LPE, SF4P/4LPP, SF4/4LPE, SF3(3GAP), SF3P and SF2 technologies. Solido SPICE is also qualified for Samsung Foundry’s FD-SOI 18FDS process technology. “Samsung Foundry has certified Siemens’ newly released Solido SPICE across a broad range ...

sureCore, the low power memory specialist, has announced that is licensing its CryoMem suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications. This is as a result of an Innovate UK-funded consortium to develop cryo-tolerant semiconductor IP. The aim of the project was to develop and prove a range ...

Siemens adds AI capabilities to unite “the design experience” across its tools portfolio. In an attempt to accelerate digital design, while dealing with constraints and resilience, Siemens has brought together its established software, Xpedition (pictured), Hyperlynx and PADS Professional, into a unified platform. The company has added cloud connectivity and collaboration, enhanced integration with its Teamcenter and NX software and ...

Japanese automotive component supplier Denso, has signed a development license agreement with Californian startup, Quadric for a neural processing unit (NPU). The agreement means Denso will acquire the IP core license for Quadric’s Chimera general purpose NPU (GPNPU). Both companies will co-develop IP for an in-vehicle semiconductor for use in intelligent vehicle systems (ADAS and AD/self-driving) and inter-vehicle and cloud ...

The semiconductor and electronics industry faces increasing demand for smart, connected devices. Software has become the key differentiator, but fragmented workflows and supply chains hinder innovation and delay time to-market. Altium Discover addresses these challenges with a cloud-based industry solution that connects semiconductor manufacturers, distributors, and product developers and fosters a more connected, efficient ecosystem. Current Industry Challenges Market Growth ...

French research lab CEA-Leti has announced an open-source cybersecurity project to produce physical true random number generators (TRNGs) for ICs using ring-oscillators. It is called OpenTRNG. “The project’s launch is timely because EU state organisations are preparing to release recommendations or requirements for TRNG security certification,” according to Leti. “For large companies, SMEs, and startups, OpenTRNG will support developing TRNGs ...

We caught up with Stephanie Dournelle, Account Technical Manager for Automotive Solutions at Siemens EDA Silicon Systems, as part of our promotional coverage for the 2024 Siemens Technology Day. Stephanie discusses the digital transformations that challenge the automotive industry, with the requirements for increasing change. For example, she covers the need to shorten development times as vehicles become more intelligent – ...

We caught up with Siraj Shaikh, Professor in Systems Security at Swansea University, as part of our promotional coverage for the 2024 Siemens Technology Day. Siraj discusses the role of academia in pushing the frontiers of knowledge, presenting a neutral playground for a lot of new ideas. And how it is well placed to work with a range of industry ...

We caught up with Heiko Dudek of Siemens EDA as part of our promotional coverage for the 2024 Siemens Technology Day. Heiko discusses why reliability is a critical aspect in automotive design, and why you have really have to plan reliability upfront. He discusses, for example, how the most important aspect for the European automotive industry going forward is the ...

We caught up with Lee Harrison, Director of Automotive IC Solutions at Siemens EDA, as part of our promotional coverage for the 2024 Siemens Technology Day. Lee discusses how Siemens is helping to make sure that Europe remains the number one supplier of automotive components. He covers, for example, the role of chiplets, how the pressure on developing more advanced ...