Solido SPICE certified for Samsung Foundry’s latest processes

Siemens Digital Industries Software says its Solido SPICE simulation tool is now certified across Samsung Foundry’s FinFET and GAA fabrication processes, including the foundry’s 14LPU, 14LPP, 8LPP, 5LPE, SF4P/4LPP, SF4/4LPE, SF3(3GAP), SF3P and SF2 technologies.

Solido SPICE is also qualified for Samsung Foundry’s FD-SOI 18FDS process technology.

“Samsung Foundry has certified Siemens’ newly released Solido SPICE across a broad range of process technologies, empowering IC developers to robustly and accurately verify their complex ICs,” says Samsung Foundry vp Hyung-Ock Kim.

For more: eda.sw.siemens.com/en-US/ic/solido/simulationsuite/.

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David Manners has more than forty-years experience writing about the electronics industry, its major trends and leading players. As well as writing business, components and research news, he is the author of the site's most popular blog, Mannerisms. This features series of posts such as Fables, Markets, Shenanigans, and Memory Lanes, across a wide range of topics.