Products

SpacePath Communications has announced a 1.5kW C-band solid-state power amplifier, intended to displace travelling wave tubes in satellite up-links. “The outdoor SSPA is suited for replacing aging indoor TWTAs, enabling service providers to eliminate long waveguide runs by installing high-power amplifiers closer to the antenna,” according to the company. “An indoor rack mount version is also available that is only ...

Rohm has introduced six miniature surface-mount top-view near-infrared LEDs. There are three packages: one measures 1 x 0.6mm and is only 0.2mm thick including a layer of encapsulation. Emission is 2.8mW/sr at 30mA. The other two measure 1.6 x 0.8mm and have either a lensed top (1.24mm tall, 5mW/sr at 20mA), or a flat top (1.06mm tall, 1.9mW/sr at 20mA) ...

Silicon Labs has moved to 22nm for its latest series of wireless MCUs for IoT nodes. Announced today, there are parts for Zigbee, Bluetooth and Matter-over-Thread, and for mains or battery power. SixG301 is the mains-powered (line-powered) family, where ‘x’ becomes ‘B’ for the Bluetooth LE (and Bluetooth mesh) focussed variant, or ‘M’ for multi-protocol types. Concurrent multi-protocol operation will ...

Aaeon has announced a 115 x 165mm industrial PC board that supports 14th gen Intel Core CPUs up to 65W, as well as gen 12 and 13 processors. “The board is positioned for applications requiring greater computing performance in space constrained smart manufacturing setups like industrial control, PLC automation and remote monitoring, where the installation of a board based on ...

From May 20 to 23, COMPUTEX 2025 was held at Taipei Nangang Exhibition Center Halls 1 and 2. Under the theme “Comprehensive Innovation, Storage Meets AI,” Longsys (301308.SZ) presented its industry-leading storage solutions and global consumer brand Lexar, showcasing its latest innovations for the AI era. Comprehensive Storage Innovation for Multi-Dimensional AI Applications Focusing on AI PCs and AI servers, ...

PocketBeagle 2 has quietly been given a quad core upgrade. Initially built around Texas Instrument’s AM6232 IC, which has dual 64bit 1GHz Arm Cortex-A53 CPUs, the development board has been upgraded to TI’s AM6254, which has four of the same cores running at 1.4GHz, plus a 3D GPU that it did not have at the original launch. The change happened ...

Silanna Semiconductor has created a laser driver IC that can squeeze a 400W quad EEL (edge-emitting laser) module into 80mm2. SL2001 comes in a 14ball 1 x 3.5mm WLCSP (wafer-level chip-scale package) includes both a capacitor charging circuit and another block to dump that stored energy into the laser diode. Operating from a power source between 3 and 24V it ...

Analog Devices has created a fast power op-amp that can handle ±55V rails and ±1A outputs, with a digital control bus for setting internal parameters. Called ADHV4710, the output can swing ±52V with ±100mA loading, and its rails can vary down to ±12V. Despite being able to drive ±1300V/μs into 1nF, it is a voltage feedback amplifier, that can handle ...

Toshiba has introduced a set of industrial-grade 650V SiC mosfets in 8 x 8mm DFN packaging. Of the four new devices, the company picks TW054V65C as its poster child for low turn-on and turn-off losses: 122 ad 58μJ respectively when a pair are used in a 400V 20A half-bridge* – said to be ~55% and 25% less than the company’s ...

US car maker Rivian has signed up Infineon to supply traction inverter power modules, microcontrollers and power ICs for its ‘R2’ vehicle platform, expecting to start in 2026. The power modules will be in Infineon’s HybridPack Drive G2 format (pictured) and include both silicon and silicon carbide components. Along with these, Rivian has picked infineon’s established TC3x MCUs, not not ...