Memory

Kioxia is sampling CD9P Series PCIe 5.0 NVMe SSDs built with TLC-based 3D flash memory. BiCS flash uses CBA (CMOS directly Bonded to Array) technology which boosts power efficiency, performance, and storage density while doubling the capacity available per SSD compared with the previous generation model. The CD9P Series drives deliver 4-corner performance improvements of up to approximately 125% in ...

Micron is sampling HBM4  are built on the company’s 1ß DRAM process, with 12-high packaging technology and  memory built-in self-test (MBIST). Volume production is scheduled for next year. With a 2048-bit interface, achieving speeds greater than 2.0 TB/s per memory stack, the device  delivers 60% better performance over the previous generation while having 20% better power efficiency than HBM3E. Hynix ...

We caught up with Robert Fan, the SVP of Global Sales at Silicon Motion, as part of our promotional coverage for Embedded World 2025. He discusses Silicon Motion unveiling its latest storage and display solutions for AI, industrial, and embedded applications. Highlights include PCIe NVMe SSD controllers, Ferri embedded storage, the SM770 multi-display SoC, and the MonTitan 128TB QLC SSD—offering ...

Earlier today, Anglia Components  signed an agreement to support and supply the full range of legacy and new memory products, including SRAM, DRAM and Flash, manufactured by Alliance Memory. The Alliance products are pin-for-pin drop-in replacements for devices originally supplied by Micron, Samsung, Infineon/Cypress, Macronix, ISSI, Nanya, Hynix, and others.  “Alliance Memory’s competitive pricing, multi-source supply strategy and secure inventory ...

From May 20 to 23, COMPUTEX 2025 was held at Taipei Nangang Exhibition Center Halls 1 and 2. Under the theme “Comprehensive Innovation, Storage Meets AI,” Longsys (301308.SZ) presented its industry-leading storage solutions and global consumer brand Lexar, showcasing its latest innovations for the AI era. Comprehensive Storage Innovation for Multi-Dimensional AI Applications Focusing on AI PCs and AI servers, ...

Kioxia is sampling its first enterprise SSDs built with its 8th generation BiCS FLASH TLC which incorporates CMOS directly Bonded to Array (CBA) technology. CBA is claimed to deliver advances in power efficiency, performance and density, and sustainability, while doubling available capacity per flash device. The CM9 Series SSDs deliver performance improvements of up to approximately 65% in random write, ...

Addressing the growing use of AI and high-performance computing, JEDEC has published a new high-bandwidth memory (HBM) DRAM standard: HBM4. It aims to improve the performance, efficiency, and scalability of the memory required to power the next generation of AI, HPC (high-performance computing), and graphics workloads. For example, the next generation AI training and inference systems. HBM4 With transfer speeds ...

At Embedded World 2025 we caught up with Coby Hanoch, the CEO of Weebit Nano, as part of our promotional coverage for the event. He discusses how Weebit Nano is a leading developer of advanced semiconductor ReRAM memory technology that will drive the proliferation of intelligent devices. The company is focused on delivering the industry’s most advanced memory technologies that ...

On March 3, Longsys (SZ.301308), a branded semiconductor memory enterprise, made its first-ever appearance at MWC 2025 in Barcelona. Under the theme “New Mode of Storage Empowering Global Mobility”, it showcased a series of innovative storage products, attracting widespread attention. PTM Business Model: Full-Stack Customization Service The Product Technology Manufacturing (PTM) model was a major highlight, showcasing Longsys’ full-stack customization ...

JEDEC – the Solid State Technology Association – is publishing JESD220G: Universal Flash Storage 4.1, an update to the UFS standard. Aimed at applications where power efficiency is essential, UFS 4.1 offers faster data access and improved performance, says the standards body. It also maintains hardware compatibility to UFS 4.0. For example, it will be relevant for mobile applications and ...