Memory

Embedded NVM such as ReRAM, coupled with smart memory partitioning, can improve the energy efficiency of battery-operated and energy-harvesting ICs, observes Ilan Sever. Low power consumption is a key design consideration, especially for battery-operated IoT devices with Bluetooth Low Energy or energy-harvesting technology, and for medical devices such as wearables and implantables. These devices must ensure that data gathered by ...

At Electronica 2024 we caught up with Paul Plitzuweit, Senior Product Manager at Datakey, as part of our promotional coverage for the event. In this interview, he discusses how Datakey Mini-Bar receptacles and memory tokens form a portable memory system that is designed for small embedded systems requiring a robust credential or removable memory device for harsh environments. Designed to ...

JEDEC, the Solid State Technology Association, has published JESD230G, the NAND Flash Interface Interoperability Standard. The standard introduces speeds of up to 4,800 MT/s, as compared to 400 MT/s in the first version of JESD230, which was published in 2011. JESD230G The standards body highlights that JESD230G also adds a separate Command/Address Bus Protocol (SCA). It improves throughput and efficiency ...

Infineon Technologies has introduced a radiation-hardened 512Mbit QSPI NOR flash memory for space applications and other extreme environments. “The device offers a 133MHz quad serial peripheral interface and the highest density, radiation and single-event effects performance available in a QML-qualified non-volatile memory for use with space-grade FPGAs and microprocessors,” claimed the company. To puts some numbers on these radiation claims, ...

The much-anticipated Electronica Munich has officially opened. At this international event, Longsys (301308.SZ) launched a range of new products alongside its PTM (Product Technology Manufacturing) business model, with a focus on industrial and automotive storage solutions to meet the global demand for intelligent storage across various industries. Global Expansion of Storage Solutions International Debut of the PTM Business Model Longsys ...

The JEDEC Solid State Technology Association has announced the PS-007A LPDDR5 CAMM2 Connector Performance Standard, for the “LP5CAMM2” compact form factor. The microelectronics standards body says the connector offers a “standardized modular LPDDR5 solution with ecosystem support”. It contrasts this with the traditional LPDDR5 memory-down approach. Possible applications include solid state drives and GPUs. “Specifically designed for devices that require ...

Today, Kioxia is expected to file papers for an IPO on the Tokyo Stock Exchange in the next six months using a new listing process which has not been used before, reports the Nikkei. Kioxia decided not to go ahead with a planned listing in October because market conditions were deemed unfavourable. Under the new IPO process, the company submits ...

Longsys to Debut Dual-Brand Innovations and PTM Business Model at Electronica 2024 in Munich From November 12-15, 2024, Longsys, a branded semiconductor memory enterprise, will be unveiling its latest innovations in memory technology at Electronica in Munich. As an innovative memory solution manufacturer that integrates R&D, design, packaging and testing, manufacturing, and sales services, Longsys has been recognized for its ...

The JEDEC Solid State Technology Association has published its JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, supporting the memory module configurations known as “raw cards” (JESD401-5B). This is consistent, says the standards body, with the recently updated contents of JESD401-5B DDR5 DIMM Label and JESD318 DDR5/LPDDR5 Compression Attached Memory Module (CAMM2) Common Standard. JESD406-5 The new publication documents the ...

A team from KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024. The KIOXIA engineering team, consisting of Hideaki Aochi, Ryota Katsumata, Masaru Kito, Masaru Kido, and Hiroyasu Tanaka, will accept this prestigious award for its pioneering work in developing and commercialising 3D flash memory. ...