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Q5D Technology, the Bristol developer of tools for robotic wiring harness manufacture, has taken delivery of the core structure of frame and drives for its latest and largest to date wire harness automation robot at its Bristol headquarters in the UK. The frame of the robotic cell will undergo final assembly and be ready for service as the world’s most ...

CyberWhiz, a team of experts in embedded, mobile, and cloud cybersecurity has set up a UK office in Cheltenham, UK. The company offers a range of proven hardware and software security products and services based on decades of in-house experience at Beko, a leading domestic appliances manufacturer and part of Arçelik A.Ş., based in Turkey. CyberWhiz customers can choose to ...

RANsemi, a British wireless semiconductor innovator specialising in 5G Open RAN baseband technologies, today announced that it is collaborating with ACES. a leading Saudi Arabian neutral host operator, in a strategic Open RAN partnership. The partnership, endorsed and funded by the Saudi Arabian National Technology Development Programme (NTDP) under the umbrella of the Saudi Ministry of Communication and Information Technology ...

DeteQt, a  sensing startup, has secured $750,000  in pre-seed funding from Australia’s Main Sequence Ventures and ATP Fund. DeteQt, a spinout from the University of Sydney Nano Institute, has a  ‘diamond-on-silicon’ technology which it is using to make quantum magnetometers. DeteQt’s CEO, University of Sydney Adjunct Professor Jim Rabeau, (pictured) will announce the investment at this week’s Quantum Australia Conference. ...

Imec and Zeiss have signed a Strategic Partnership Agreement. “For the research and development of cutting-edge semiconductor technologies, the expertise and technological experience of industry partners like ZEISS is essential. Therefore, we are very pleased to strengthen our partnership even further,” says Luc Van den hove, CEO of imec. With the signed agreement, the two cooperation partners reaffirm their joint ...

The University of Strathclyde has received £9 million from Innovate UK to pursue semiconductor packaging R&D. The intention is to provide  an advanced packaging line for power electronic semiconductors which will reduce packaging times  from months to days. Global materials shortages, limited manufacturing capacity, and a lack of facilities for innovation have left the UK supply chain reliant on international ...

indie Semiconductor, the automotive SiPho and sensor specialist,  is to use Globalfoundries’ 22nm FD-SOI process for its 77GHz and 120GHz radar SoCs for ADAS and industrial applications. .Automotive radar adoption is being accelerated by global vehicle safety regulation, new car assessment programs, and consumer demand for convenience features. As a result, new vehicles will feature at least four radar sensors, ...

The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025 at the Gaylord Texan Resort & Convention Centre. ECTC combines packaging, components, and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. The flagship conference of the IEEE Electronics Packaging Society, ECTC 2025 offers a finalised technical programme ...

Intel has put back its $100 billion Ohio chip project until 2030 or 2031. The first fab in the multi-fab project will not be completed until 2030. It had been due to start this year. The completion of the second Ohio fab has been put back to 2031 with first silicon in 2032. Ohio is the  second multi-fab complex which ...