Electronics Weekly
ECTC combines packaging, components, and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange.
The flagship conference of the IEEE Electronics Packaging Society, ECTC 2025 offers a finalised technical programme of some 400 technical papers in 36 oral and five interactive sessions, one of which is a student session; 12 special sessions on selected topics; a range of professional development opportunities; 135+ exhibits showcasing industry-leading product and service companies from around the world; and various social events and student outreach activities to facilitate networking.
The range of topics to be covered at ECTC 2025 encompasses heterogeneous integration, photonics, components, materials, assembly, reliability, modeling, interconnect design and technology, 2.5D/3D/3.5D integration technologies, direct/hybrid bonding, device/system packaging, wafer-level packaging, optoelectronics and more.
The Electronic Components and Technology Conference keynote is:
- Achieving Efficient Zettascale Compute in the AI Era, by Samuel Naffziger, Sr. Vice President and Corporate Fellow at AMD.
The demand for compute, and for the energy to power it, is increasing faster than ever before. Meeting the challenge of delivering this processing power in the AI era requires holistic innovation from the device to the datacentre level.
It starts with integrating highly optimized, domain-specific accelerators with advanced 2.5D and 3.5D packaging to maximize the amount of compute within the most efficient, local communication domain.
These accelerators and other system components must be packed into tightly integrated sleds that minimize losses and power for high-speed communication, while taking advantage of workload-aware power management.
Scaling to the rack and datacenter level will require many advances in signalling technologies, rack design and power optimisation
to enable the training and inference computation required by the most demanding frontier models.
This talk will cover these trends and the key technologies that will power compute growth at a scale we wouldn’t have conceived of just a few short years ago.
In addition to the keynote talk, ECTC 2025 includes a series of Special Sessions, which feature industry experts discussing technology status and roadmaps in key areas of interest.
The ECTC 2025 Special Sessions also include:
- Ultra High-Density Interconnect Technologies and Supply Chain Readiness for AI & HPC
- Hybrid Bonding (HB): to B, or not to B? Needs and Challenges for the Next Decade
- Quantum Photonic Advanced Packaging
- Glass Core vs. RDL Interposers: Ready for Prime-Time?
- Advanced Materials for Enabling Co-Packaged Optics Integration
- Advances in Chiplets: Tackling Fault Isolation and Failure Analysis in Heterogeneous Integration
- Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications
- Thermal Management Solutions for Next-Generation Backside Power Delivery
- IEEE EPS Seminar: User Perspective of Chiplet Technology
- ECTC 2025 Plenary Session: Emerging Advanced Power Delivery for the AI Computing Era
- IEEE EPS President’s Panel: Challenges and Benefits of Recruiting and Retaining a Diverse Workforce
Another special session is a competition where both students and start-up companies will pitch their innovative ideas to a jury panel, followed by audience Q&A, jury deliberation, and then awards and a networking
ECTC 2025 will also feature a Heterogeneous Integration Roadmap (HIR) workshop with four focused discussions:
- IoT & AI at the Edge
- Advancing Heterogeneous Integration through Metrology & AI
- Integrating Photonics in HPC & Network Systems
- Advances in Panels, Substrates, and Printed Circuit Boards.
In addition to the technical program, ECTC 2025 offers 16 Professional Development Courses (PDCs). These are offered in conjunction with the co-located IEEE ITherm Conference, which focuses on thermal/thermomechanical issues in electronic systems.
These four-hour courses are on a variety of relevant electronic packaging topics and are taught by world-class experts, enabling participants to broaden their technical knowledge base.
Attendees will be awarded either CEU or PDH credits (continuing education units or professional
The ECTC Reception Gala on Thursday, May 29 will feature a special event to celebrate the conference’s 75thanniversary.
For registration and other information: https://www.ectc.net/index.cfm
