Electronics Weekly
Intel has put back its $100 billion Ohio chip project until 2030 or 2031.
The first fab in the multi-fab project will not be completed until 2030. It had been due to start this year.
The completion of the second Ohio fab has been put back to 2031 with first silicon in 2032.
Ohio is the second multi-fab complex which Intel has delayed, the first was in Germany at Magdeburg.
“As we continue to invest across our US sites, it’s important that we align the start of production of our fabs with the needs of our business and broader market demand,” says Intel vpm Naga Chandrasekaran, “this has always been our approach, as it allows us to manage our capital responsibly and adapt to the needs of our customers.”
