Strathclyde Uni gets £9m for IC packaging R&D

The University of Strathclyde has received £9 million from Innovate UK to pursue semiconductor packaging R&D.

The intention is to provide  an advanced packaging line for power electronic semiconductors which will reduce packaging times  from months to days.

Global materials shortages, limited manufacturing capacity, and a lack of facilities for innovation have left the UK supply chain reliant on international markets for key components, resulting in long delays. .


“At the National Manufacturing Institute Scotland (NMIS) we work with manufacturers of all sizes to help them boost productivity and efficiency and we’re excited to help grow the semiconductors supply chain here in the UK and secure a lead in sector innovation,” says Professor Matt Boyle, Director of Electrification at NMIS which hosts the facility,


“As the operator of the National Manufacturing Institute Scotland, we are committed to driving innovation and supporting industry in the transition to more sustainable and resilient manufacturing,” says Professor Sir Jim McDonald, Principal and Vice-Chancellor of the University of Strathclyde, “by leveraging our world-class research, technical expertise and facilities, this initiative will enhance the UK’s technological capabilities, create high-value opportunities for businesses, and reinforce Scotland’s position as a global leader in advanced manufacturing.”

David Manners

David Manners

David Manners has more than forty-years experience writing about the electronics industry, its major trends and leading players. As well as writing business, components and research news, he is the author of the site's most popular blog, Mannerisms. This features series of posts such as Fables, Markets, Shenanigans, and Memory Lanes, across a wide range of topics.

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