At Embedded World 2025 we caught up with Wayne Lyons, senior marketing director of the automotive business at AMD, as part of our promotional coverage for the event. He describes how AMD technologies are transforming automotive ADAS and in-vehicle experiences, from driver assist and driver monitoring features to AAA gaming and entertainment in the car. Thank you to Wayne for ...
“IAR is transitioning from selling individual products with perpetual ownership to offering our entire toolbox in a platform, as a customer-friendly subscription service,” announced CEO, Cecilia Wachtmeister (pictured). The scalable software design tools include the company’s Embedded Workbench, with C/C++ compiler and the company’s Build tools. IAR C-STAT (for static code analysis) and IAR Embedded Trust (for end-to-end security) and ...
the organisers of this year’s Design and Verification Conference & Exhibition Europe (DVCon Europe) have announced the deadline for abstracts for engineering papers and tutorials for this year’s event. Abstracts need to be submitted by 22 April, with full engineering and research papers required by 30 June. DVCon Europe will be hosted by Accellera Systems Initiative, and will take place ...
At Embedded World 2025 we caught up with Manuel Alves, of SVP Automotive Microcontrollers at NXP Semiconductors, as part of our promotional coverage for the event. The interview showcases the recently announced S32K5 microcontrollers family and its pivotal role in the automotive industry’s transformation toward software-defined vehicles (SDVs). Manuel highlights the key features and benefits that set the MCU family apart ...
Earlier this month more than 1,900 exhibitors gathered in the Bavarian city 0f Nuremburg for Embedded World, which showcased hardware, embedded software and tools. Steve Bush selects some of the highlights. Intel’s Processor N-series computer-on-modules (COMs) were shown by Seco. Called Twin Lake, the processors have up to eight ‘efficiency’ cores and are aimed at applications dissipating 6W to 15W. ...
Following on from last year’s Embedded World announcement that Tria Technologies will be working with Qualcomm Technologies on high performance embedded compute modules. The embedded specialist unveiled more of the partnership roadmap in Nuremberg this year. There were five new Tria-branded modules, based on Qualcomm’s Dragonwing and Snapdragon technology at this year’s Embedded World conference. These are the Tria IQ-9075 ...
A roundup of all the latest electronics news from Embedded World in Nuremberg.
Pushing back against ever hotter computer-on-modules, Congatec is offering heat-pipe based heatsinking, using acetone as a working fluid to accommodate sub-0°C switch-ons – operation is over -40 to +85°C. “Acetone cooling will become an option for the conga-TC675 and conga-TC675r,” the company told Electronics Weekly. “Most likely, they can be ordered off-the-shelf by Q3 – the acetone coolers themselves are ...
Red Pitaya has upgraded its Stemlab 125-14 four-channel 60Mz software-defined test instrument. “This next-generation series enhances performance and reliability while maintaining backward compatibility,” according to the company. “With improved features such as enhanced RF input performance, USB-C connectivity, and a compact design, the Gen 2 series is designed to facilitate signal acquisition, generation and processing, whether used in educational settings, ...
Embedded World 2025: Synopsys says its Virtualizer Native Execution prototyping tool will accelerate software development for edge devices. It extends the Virtualizer tool suite and model libraries to Arm hardware, allowing virtual prototypes to be built, executed and tested directly on Arm-based machines. The Native Element factor in the new tool means that users can execute virtual prototypes directly on ...
Electronics Weekly
