Electronics Weekly
The embedded specialist unveiled more of the partnership roadmap in Nuremberg this year. There were five new Tria-branded modules, based on Qualcomm’s Dragonwing and Snapdragon technology at this year’s Embedded World conference. These are the Tria IQ-9075 Vision AI-KIT powered by the Dragonwing IQ-9075 processor (pictured), the SMARC QCS6490 powered by the Dragonwing QCS6490 processor, the SMARC QCS5430 powered by the Dragonwing QCS5430 processor, the IQ-615 (OSM and SMARC) powered by the Dragonwing IQ-615 Processor and the Snapdragon X Elite (Com Express and Com HPC) powered by the Snapdragon X Elite.
Tria’s OSM (Open Standard Modules) and SMARC modules are designed for industrial automation and robotic applications, explained Alex Woods, global marketing director, Avnet.
Tria is an Avnet company; it designs and manufactures embedded compute boards and systems and has in-house design and manufacturing campuses in multiple European countries as well as extended design and manufacturing capabilities in North America and Asia.
Tria claims to have the market’s largest SMARC portfolio and described the new Dragonwing-based modules as being applicable to low- to high-end applications. “
“Dragonwing processors are designed to provide high-performance, low-power edge computing and on-device AI,” said Daniel Denzler, senior director, business line management for boards and systems at, Tria Technologies.
“We are excited to see how Tria’s new embedded modules will empower industrial customers to push the boundaries of what is possible with AI,” added Douglas Benitez, Senior Director, Business Development for Qualcomm Europe.
