News

Soitec, the French wafer manufacturer, has announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at the wafer level. This marks the first public announcement of Soitec’s TLT technology. The technology is an enabler ...

Imec has fabbed Ruthenium (Ru) lines at 16nm pitch with average resistance as low as 656Ω/µm. The 16nm pitch metal lines were fabricated using a semi-damascene integration flow optimized for cost-effective manufacturability, making it an attractive approach for fabricating the first local interconnect metal layer of the A7 and beyond technology nodes. Ruthenium (Ru) semi-damascene has been originally proposed by ...

With the Defence Secretary John Healey announcing the UK’s strategic defence review, a RUSI report (Royal United Services Institute) highlights a ‘defence dividend’ for local areas hosting the UK defence industry. RUSI supports the Government’s position that the defence industry can be an important driver of economic growth. Basically, boosting the economic case for increased spending on the UK’s defence ...

Electronics Weekly has begun its search for the shining stars and leading lights of the international electronics industry. As well as categories to showcase design excellence, did you know we have some new categories this year, designed to bring out the best personal qualities and corporate ethos that make people proud. Some of this year’s categories are designed to bring ...

The GMSL serial bus is to be standardised as OpenGMSL with the formation of an industry body to be called the OpenGMSL Association. It will also style itself ‘OGA’. “With a standard for video and high-speed data transmission based on ‘gigabit multimedia serial link technology’, adoption and innovation of the OpenGMSL standard will reshape autonomous driving, driver assistance systems and ...

Würth Elektronik has combined Classic and LE version 5.4 in a single Bluetooth module measuring 16.6 x 12 x 1.7mm including its antenna. Called Skoll-I, “the module is already certified for conformity in all major target markets”, said Wurth. The “module offers an opportunity for developing devices that need to connect to both legacy and modern devices. [It] also offers ...

We caught up with Robert Fan, the SVP of Global Sales at Silicon Motion, as part of our promotional coverage for Embedded World 2025. He discusses Silicon Motion unveiling its latest storage and display solutions for AI, industrial, and embedded applications. Highlights include PCIe NVMe SSD controllers, Ferri embedded storage, the SM770 multi-display SoC, and the MonTitan 128TB QLC SSD—offering ...

Elon Musk’s Neuralink startup which develops chips for implanting in the brain has raised $650 million to add to the $600 million it raised in May. Additionally, Musk has engaged Morgan Stanley to arrange debt of $5 billion for xAI, his AI startup. Investors in Neuralink included: ARK Invest, Founders Fund, Sequoia Capital, Thrive Capital, Lightspeed, Vy Capital, Valor Equity ...

The European Space Agency (ESA) has inaugurated its European Space Deep-Tech Innovation Centre (ESDI) in Switzerland. It is the first ESA presence in Switzerland. Saying it will boost Europe’s growth and competitiveness, the agency highlighted a growing role of “deep tech” in space exploration. The centre was created in collaboration with the Paul Scherrer Institute (PSI). The location is the ...

The Qorvo QPF4557 is an integrated front end module (FEM) designed for Wi-Fi 7 (802.11be) systems. The small form factor and integrated matching minimizes layout area in the application. Performance is focused on optimizing the PA for a 5V supply voltage that minimizes power consumption to allow for systems that use digital pre-distortion to achieve the highest linear output power ...