News

The Qorvo QPF4557 is an integrated front end module (FEM) designed for Wi-Fi 7 (802.11be) systems. The small form factor and integrated matching minimizes layout area in the application. Performance is focused on optimizing the PA for a 5V supply voltage that minimizes power consumption to allow for systems that use digital pre-distortion to achieve the highest linear output power ...

Nisshinbo Micro Devices, the analogue IC specialist,  has brought out a  dual audio operational amplifier with  “MUSES” audio technology. The NL8902 offers low-noise performance with a voltage noise density of  10 nV/√Hz at 1 kHz and distortion at 0.0004% at the same frequency. The amplifier achieves a high slew rate of 20 V/µs and a gain bandwidth product of 9 ...

Earlier today, Anglia Components  signed an agreement to support and supply the full range of legacy and new memory products, including SRAM, DRAM and Flash, manufactured by Alliance Memory. The Alliance products are pin-for-pin drop-in replacements for devices originally supplied by Micron, Samsung, Infineon/Cypress, Macronix, ISSI, Nanya, Hynix, and others.  “Alliance Memory’s competitive pricing, multi-source supply strategy and secure inventory ...

AccelerComm, the Southampton company delivering 5G from satellites, has closed a $15 million funding round. The capital will be used to further develop and accelerate deployments of the company’s 5G satellite communications products and technology that enable Direct-to-Device (D2D) communications between phone handsets and space-based satellite networks. The round was led by IP Group, including its Parkwalk and Hostplus managed ...

Saimemory, a new company set up by SoftBank and Intel, is developing a stacked DRAM alternative to HBM which uses half the power of HBM, reports the Nikkei. A prototype is two years away and production is expected by the end of the decade. The initial technology came from Intel, Tokyo University and other Japanese academic sources. The project is ...

TSMC is looking at the possibility of building six fabs in the UAE, reports Bloomberg. Last September the Wall Street Journal reported that both TSMC and Samsung had visited the UAE to talk about building fabs there. Talks with the Biden administration about the plan broke down when the US government said it would need assurances that the US would ...

The EU Startup and Scaleup Strategy tagged: “Choose Europe to Start and Scale” aiming: “to make Europe a startup powerhouse”, has been met with a sceptical response The strategy’s proposals  include reducing admin requirements, a €10 billion startup fund, interconnected EU universities, facilitating stock options, cross-border employment and access to infrastructure. “With the launch of the EU Startup and Scaleup ...

PC volume is expected to reach 274 million in 2025, growing +4.1% y-o-y, says IDC. For 2026, IDC forecasts a slight contraction due in part from volume stabilization following Windows 11 migration and to a more difficult comparison given a stronger market in 2025. “While enterprises and the public sector led early demand, accelerating upgrades from SMBs are poised to ...

A UK government initiative worth £4.75 million, sees the UK Electronics Skills Foundation (UKESF) launching the Semiconductor STEP programme (Skills, Talent and Education Programme). With demand for semiconductor skills vastly outstripping supply, the goal is to help tackle the skills shortage in the UK’s semiconductor sector. STEP Partners Effectively, building a  pipeline of skills and enabling more young people to ...

Lighter connectors contribute to reduced overall system mass, which is particularly important in weight-sensitive applications such as aircraft, satellites and drones, explains John Brunt. Reducing the weight of connectors and cables in applications such as aerospace, electric vehicles (EVs) and space systems is crucial for enhancing performance, fuel efficiency and overall system reliability. Connectors are generally heavier than other components ...