Electronica

With the successful conclusion of Electronica 2024, leading global enterprises in the electronics sector showcased their latest technologies and innovations. As a prominent player in electronic component distribution, WIN SOURCE garnered significant attention from industry experts, customers, and partners with its advanced quality control technologies. During the exhibition, WIN SOURCE stood out with its highly interactive booth design. The booth ...

Increasing direct business is the aim for Texas Instruments, confirmed EMEA president, Stefan Bruder (pictured). “The goal is to get inhouse manufacturing to 95% by 2030,” he told Electronics Weekly. The company has tripled its Frankfurt product distribution centre to 9,000 sq m, and has two fabs ramping up at present with five others being built in addition to two ...

Don’t miss the Electronics Weekly roundup of all our latest news from Electronica, the bi-annual event running from 12-15 November in Munich. Electronica is the world’s biggest electronics show, and Electronics Weekly will be covering it extensively, to discover the latest products, developments and trends in the industry. And if you’re in Munich, do come and say hello to the Electronics ...

The much-anticipated Electronica Munich has officially opened. At this international event, Longsys (301308.SZ) launched a range of new products alongside its PTM (Product Technology Manufacturing) business model, with a focus on industrial and automotive storage solutions to meet the global demand for intelligent storage across various industries. Global Expansion of Storage Solutions International Debut of the PTM Business Model Longsys ...

SIMCom announced a ‘RedCap’ (reduced capability) 5G wireless comms module at Electronica in Munich this morning. “RedCap is very attractive for customers seeking the rapid deployment of IoT applications that meet 5G requirements, but which must also consider cost,” said SIMCom sales director Mads Fischer. “Our new RedCap modules enable systems designers to get up and running quickly and easily.” ...

Melexis is aiming at replacing reed switches in automotive door door handles, sun visors, infotainment buttons and brake lights with a micro-power Hall effect switch. “For modern vehicles, accurate switch and latch mechanisms are relied upon by countless systems for feedback,” said the company. “With numerous switches deployed across cars, it is also important to ensure that they minimise power ...

Chomerics announced a cure-in-place thermal gap filler material that remains flexible after curing, at Elecronica today. CIP 60 offers 6W/mK conductivity, and cures to a Shore hardness of 50 (ASTM 2240 method). “This not only provides an alternative to hard-curing dispensable materials in electronics cooling applications, but also offers an improvement over standard application methods associated with thermal gap filler ...

NeoCortec and Embit revealed bi-directional wireless mesh networking using LoRa modulation at Electronica in Munich yesterday. “The various wireless connectivity technologies all exist because they all address different challenges,” said NeoCortec CEO Thomas Steen Halkier. “We expect this development to unlock many wireless networking opportunities in smart buildings and other applications.” NeoCortec contribution here is a proprietary protocol stack for ...

Lake Shore Cryotronics is aiming at the characterisation of 2D and nano electronic devices with a source measure unit capable of resolving 3nV and 1fA. A source measurement unit is essentially a four-quadrant power supply with in-built voltage and current measurement. “As traditional materials-based semiconductor devices continue to shrink and operate at ever-lower signal levels, engineers find it more difficult ...

Siemens adds AI capabilities to unite “the design experience” across its tools portfolio. In an attempt to accelerate digital design, while dealing with constraints and resilience, Siemens has brought together its established software, Xpedition (pictured), Hyperlynx and PADS Professional, into a unified platform. The company has added cloud connectivity and collaboration, enhanced integration with its Teamcenter and NX software and ...