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Caroline Hayes

Caroline Hayes is the editor of Electronics Weekly. She has been covering the electronics industry for over 30 years, edited UK and pan-European titles and contributed to UK and international online and print publications. Although specialising in the semiconductor market, she also has a keen interest in education, careers and start-up opportunities in the broader electronics industry.

Silanna signs Astute for Europe and India

Silanna signs Astute for ADC Europe and India

Astute Group has signed a distribution agreement with Silanna Semiconductor to distribute its Plural ADCs in Europe and India. According to Astute, Plural ADCs offer a more affordable and versatile option with shorter lead times compared to current market alternatives. They are factory-configurable, providing over 150 ADC variants with sample rates ranging from 20 to 250Msps. The ADCs are available ...

Keysight and Synopsys employ AI for RF design migration

Keysight RFCircuit Pro

Keysight has combined it Electromagnetic Simulator with Synopsys’ AI-powered RF design migration flow for an integrated design flow to migrate from TSMC’s N6RF+ to N4P process technology. The migration workflow builds on the foundry’s Analog Design Migration (ADM) methodology to streamline the redesign of passive devices and design components to the advanced RF process rules. The collaborative migration workflow leverages ...

Atlas suite marks MIPS’ drive to co-design

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For physical AI at the edge, MIPS has introduced the Atlas Explorer portfolio. The company explained that it allows designers cycle-accurate repeatability of their workload onto a MIPS processor. It provides access to platform IP ahead of silicon availability for evaluation to enable pre-production RTL and for teams to develop optimised hardware and concepts such as digital twins to gain ...

Siemens applies AI across chip and PCB design portfolio

Agentic and generative AI Siemens EDA portfolio

DAC 2025: There was a lot of talk about AI at this year’s DAC but one of the most significant was that Siemens Digital Industries Software has added generative and agentic AI capabilities across its EDA portfolio. The EDA AI system applies across all semiconductor and PCB design suites, including Questra, Tessent, Xpedition, Veloce, Catapult, Calibre, Aprisa and Solido.  “It ...

Translation tool tackles optimisation in large SoCs

Sam Appleton CEO Ausdia

Designers looking to optimise PPA (power, performance, area) are finding that optimisation engines can render original programmatic timing constraints unusable in their original form. At DAC 2025, Ausdia introduced Timevision OneSource which automatically generates a new version of block-level constraints after optimisation engines have worked on hierarchies, duplicate elements and performed advanced transformation. Such optimisations can save two weeks of ...

Switch fabric scales up data movement for AI  

DAC conference

San Francisco: At last year’s DAC, Baya Systems emerged from stealth mode. At this year’s event, the design software company announced a switch fabric technology that is claimed to enable a x100 increase in node density. NeuraScale is designed to overcome critical scaling and data movement challenges in AI infrastructure that are driving advanced SoCs and emerging 3D chiplet-based designs, ...

Two software tools target efficient design of 2.5D and 3D ICs

Siemens 3D Thermal management

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025. The Innovator3D IC suite advances 3D IC integration using AI to execute chip design and raise productivity, as designers increasingly reintegrate chiplets into high performance substrates, said the company. It enables IC ...

Agentic AI platform automates three stages of design

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All three stages of chip design will be automated and accelerated, says Moores Lab AI, which has introduced four design tools using agentic AI. Agentic AI is one of the buzzwords at this year’s DAC in San Francisco. Whereas generative AI generates content, agentic AI is an automation process. It autonomously makes and acts on decisions with little human intervention. ...

Dragonwing modules support varied OS

Tria Open Standard Module LF-IQ615

Embedded compute modules based on Qualcomm Dragonwing processors, now support different operating systems, with options including Android, Windows 11 IoT Enterprise, and Yocto Linux. Developed by Tria Technologies, an Avnet company, the boards are for embedded designs in the industrial, medical, agriculture and construction sectors, as well as  edge computing, machine learning and AI. The low-power Qualcomm Dragonwing processors have ...

AMS Technologies to distribute Singular Photonics’ image sensors in Europe

Singular Photonics image sensor

A strategic partnership has been announced between image sensor technology specialist, Singular Photonics, and optical technology distributor AMS Technologies. The partnership means Singular’s image sensors based on single photon avalanche diodes (SPADs) will be available to European customers. AMS will be the primary distribution and support partner for European OEMs, research labs, and system integrators. Singular provides on-chip computation to ...