For those written in the last week, our most read stories on the site cover a frame-less brush-less dc motor, the value of the compound semiconductor market, TSMC fabs in Arizona, Samsung's 2nm yield, and Microchip layoffs...
We're talking about the launch of the new Electronics Weekly CHIIPS podcast, TSMC investing in US fabs, a very frugal ST MCU, and the Westcott Drone Test and Development Centre upgrading its facilities...
Tune into this one: Electronics Weekly is excited to launch it's own podcast, CHIIPS, brought to you by our editor Caroline Hayes.
The Electronics Weekly team share some fingerposts - their picks of the week, in terms of announcements, developments, product releases, quotes, or anything else in the wide world of electronics, that caught their eye...
The building of Taiwan's chip industry, the Honda Nissan merger, Intel selling Altera to Silverlake, an ISSCC overview of next-gen high-performance CPUs, and a proposed TSMC-Intel manufacturing deal...
We're talking about new CPU and image processor technology revealed at ISSCC, Taiwan defending itself from President Trump, a super-fi 1.6W Class-D audio amplifier (again from ISSCC), and some interesting balloon-based technology...
A multi-orbit, multi-beam satellite antenna, DARPA's in-space assembly project, an FPGA-based approach to AI chips, OpenAI tapes-out its first chip at TSMC, and NXP buying Kinara...
The Electronics Weekly team share some fingerposts. We're talking AI at the Paris Summit, driving a GaN half-bridge, and DARPA research into in-space assembly...
Glasgow University research into diamond transistors, a TLC NAND with 294 layers, a Mannerisms post on a retirement crisis, Cat6A data rated cables terminated in M12 circular connectors, and Intel adopting a ‘get real’ approach to its product roadmap...
We're talking about Intel product roadmap changes, ST job cuts, bio-sensors and a satellite-enabled smartphone video call...
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