Electronics Weekly
To get the devices, called GNP2070TD-Z, into the increasingly popular ~12 x 10 x 2.4mm TOLL (TO-lead-less) package, which is finding use in high power industrial and automotive equipment, Rohm chose to out-source the back-end to ATX Semiconductor (Weihai) and “plans to partner with ATX to produce automotive-grade GaN devices”, it said.
“We are extremely pleased to have been entrusted with production by Rohm,” said ATX general manager Liao Hongchang. “We began technical exchanges with Rohm in 2017 and are exploring deeper collaboration.”
For the die – Rohm’s second generation GaN-on-Si hemts – the front-end was out-sourced to TSMC.
There are plans for higher power devices.
Applications are foreseen in server, base station, industrial and photovoltaic power supplies between 500W and 1kW.
Products will be available though DigiKey, Mouser and Farnell from March, and so far un-named on-line distributors after that.
