Electronics Weekly
LED-cooling dielectric beats copper in thermal conductivity
“It is an incredible material. We have always assumed dielectric materials will hinder the thermal performance of our LED packages but this material actually improves it,” said Litecool engineer Robert Corbin. “The thermal resistances of the LED packages we have made are so low we had trouble measuring it. We had to use nine high power LEDs in one package to give enough power density to record any difference in temperature.”
The dielectric has a thermal conductivity of 1,000W/mK – 3x higher than copper and 30x higher than alumina ceramic.
Trial packages have a thermal resistance of between 0.2 and 0.5⁰C/W depending on the construction.
“We will be able to hit new lumen density thresholds without the need for heat sinks, heat pipes or fans. We see this material initially being used in spot light applications for pin-point light sources but we also intend to incorporate it into our Lumen Block for the wider LED lighting market.” James Reeves, CEO, Litecool.
Litecool engineers have been busy recently, onto of Black X and Lumen Block, only last week is announced ‘vertical dielectric‘ – a way of removing almost all dielectric from LED power packaging to improve thermal conductivity.
Sheffield, UK, July 2015 – Litecool, has produced LED packages using a new.
