A gloomy forecast for the semiconductor industry, the use of AI for complex chip design verification, a Raspberry Pi OS update, AI infrastructure in Saudi Arabia, and Intel Foundry Services...
AMD
Stay current with AMD news at Electronics Weekly, chronicling the achievements of one of the most influential names in semiconductors. AMD continues to lead innovations in CPU, GPU, and SoC development, driving advancements in gaming, data centers, and embedded systems. Our coverage captures AMD’s major milestones, product launches, and market expansions, offering vital insights for electronics design and product development professionals seeking performance and energy efficiency in next-generation systems.
Embedded World Video: Introducing the AMD EPYC Embedded 9005 Processor
At Embedded World 2025 we caught up with Sumit Shah, Head of Product Management and Marketing at AMD, as part of our promotional coverage for the event He introduces the new AMD EPYC Embedded 9005 processor, a cutting-edge solution offering leadership core counts, expansive connectivity, and embedded features built for industrial, networking, and storage applications. Thank you to Sumit for ...
Embedded World Video: AMD driving the future of automotive
At Embedded World 2025 we caught up with Wayne Lyons, senior marketing director of the automotive business at AMD, as part of our promotional coverage for the event. He describes how AMD technologies are transforming automotive ADAS and in-vehicle experiences, from driver assist and driver monitoring features to AAA gaming and entertainment in the car. Thank you to Wayne for ...
PAVE360 SDV tech available on AMD CPUs and GPUs on Azure
Siemens Digital Industries Software announced has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360 technology for Software Defined Vehicle (SDV) development which is now available on AMD Radeon PRO V710 GPUs and AMD EPYC CPUs running on Azure. Siemens’ PAVE360 development requires graphics acceleration for accurate simulation of scenario realisation, as well as accelerated execution of ...
EW BrightSparks 2024 profile: Philip Heptonstall, Edinburgh University / AMD
Now in its seventh year of awards, EW BrightSparks sees Electronics Weekly highlight and celebrate some of the brightest and most talented young engineers in the UK today. Continuing our series on the latest EW BrightSparks of 2024, we profile Philip Heptonstall, a UKESF Scholar, a student at Edinburgh University and Co-Op Intern at Advanced Micro Devices (AMD). Achievements Philip has ...
SC24: AMD EPYC 9005 in OPC servers
MSI will unveil its latest AMD EPYC 9005 series CPU-based server boards and platforms at SuperComputing today. “As AI continues to reshape the landscape of data centre infrastructure, MSI’s servers, powered by EPYC 9005 Series processors [are] ideal for modern data centres,” said MSI general manager Danny Hsu. “Our servers optimise thermal management and performance for virtualised and containerised environments.” ...
Most Read – Intel foundry, Intel 18A process, AMD auto FPGA
A $3.5 billion foundry contract, the road ahead for Intel, AMD launching auto-qualified FPGAs, Intel securing a customer for its 18A process, and alternatives for IGBTs...
Most Read – ESMC, Automotive semiconductors, Raspberry Pi 5
A jv between TSMC, Bosch, Infineon and NXP, the decline of the RAN market, AMD buying a server manufacturer, the value of the automotive semiconductor market, and the new lower-cost Raspberry Pi 5 model...
What caught your eye this week? (Micro fan, AMD, Stretchy sensor, RPA)
We're talking cooling fans the size of a finger nail, AMD buying a server manufacturer, researchers creating a simple stretchy sensor, and GEO satellites supporting remotely piloted aircraft...
Five reasons to consider a SOM vs a chip-down design
The growing interest in exploring modular hardware instead of a traditional chip-down approach requires an understanding of the pros and cons of each approach, say James Jaksich and Camron Chilton. There are five key benefits of a system-on-module (som) approach, which will help engineers through the make vs buy decision process. Flexibility Standards defining size, connectors and interfaces play a ...