Electronics Weekly
Design Team of the Year
Winner – NXP S32N55 design team
The team achieved success with many firsts, including the automotive industry’s first 5nm ASIL D safe processor, NXP’s first 5nm device and the company’s first use of parallel digital twins to accelerate schedule and enable early software development. It was also the first device bring-up in only five days (compared with a typical period of three months).
SHORTLIST
i4 Product Design
Slipstream Engineering Design
Synaptics Astra Development Team
Test Product of the Year
Winner – Rohde & Schwarz MXO 5 oscilloscope
This is the first eight-channel oscilloscope with 4.5 million acquisitions per second and the first with digital triggering on all channels. It has ultra-short (20ns) blind time and 45,000 FFT/second comparable to mid-class spectrum analysers.
The judges commented that the reduced idle and operational power consumption is a good indication that the company is taking sustainability seriously. They also liked the introduction of the zone triggering feature.
SHORTLIST
IT6600C bidirectional programmable DC power supply –
ITECH Electronics
Sapphire force-displacement switch test machine – Snaptron
SuperGuard Amsterdam version 1.2 – Solid Sands
Semiconductor Product of the Year (Digital)
Winner – Ambarella N1 A1 SoC series
This SoC series is for use in smart cameras and autonomous robotics systems. It is optimised for next generation AI processing with up to three times greater power efficiency per token than GPUs, enabling seamless integration of multimodal large language models. It ensures superior performance, privacy and cost-effectiveness in AI applications across diverse industries.
The judges were impressed and said that the product outperforms competitors and is opening new markets for machine vision and robotics.
SHORTLIST
Highly commended
Lattice Avant FPGA platform by Lattice Semiconductor
I/O chiplet – Alphawave Semi
Apollo510 MCU – Ambiq
MediaTek Dimensity 9300+ – MediaTek
nPM1300 power management IC (PMIC) – Nordic Semiconductor
Renesas AI MPU RZ/V2H – Renesas Electronics
RA8 series MCUs based on Arm Cortex-M85 processor –
Renesas Electronics
xG26 family of wireless SoCs and MCUs – Silicon Labs
SC1320A Nessum communication IC – Socionext Europe
Semiconductor Product of the Year (Analogue)
Winner – Novelda X7 UWB radar SoC and turnkey module
This is the first and only low power, multi-channel, highly flexible UWB radar SoC, optimised for human presence sensing, seat occupancy and vital signs detection. It can sense the breathing of a baby within a 10m perimeter using power levels of under 100uW. There is an option to access the raw data for those who want to implement their own detection algorithms, supporting complex use cases such as vital signs monitoring or gesture recognition.
SHORTLIST
Highly commended
Aura Noiseless GaAs avalanche photodiode infrared
sensors by Phlux Technology
EPC2361 – first GaN FET with 1mΩ on-resistance – Efficient Power Conversion
Impinj M800 series RAIN RFID tag chiES – Impinj
MLX90830 – Triphibian absolute MEMS pressure sensor IC
– Melexis
GaNSafe power ICs – Navitas Semiconductor
Aura Noiseless InGaAs avalanche photodiode infrared sensors – Phlux Technology
FemtoClock 3 with 25fs-rms jitter – Renesas Electronics
Epoch platform MEMS OCXO – SiTime
Excellence in Product Design Award (Hi-Reliability Systems including Medical)
Winner – Taoglas Inception HP5354. A “Patch-in-a-Patch” antenna
The HP5354.A GNSS L1/L5 low-profile “patch-in-a-patch” antenna offers dual-band stacked patch performance in a single patch footprint. The dual-feed surface mount design reduces antenna height by 50%, decreases weight and saves horizontal real estate for high-precision GNSS applications.
The judges were impressed with the antenna design, functionality and innovative features.
SHORTLIST
UTC-124 – Advantech Europe
World’s first 20-minute retail Express DNA test – DnaNudge
Lica 4 – Eskan Electronics
ISLVERSALDEMO2Z power reference design for AMD’s XQRVC1902 Versal Adaptive SoC – Renesas Electronics
Design Tool and Development Software
Winner – Synopsys.ai Copilot
Synopsys.ai Copilot is the industry’s first GenAI solution for chip design, demonstrating Gen AI’s potential to assist even the most complicated engineering tasks. By enabling faster and more efficient semiconductor design, Synopsys.ai Copilot helps semiconductor companies to design higher performing and more power-efficient computing.
The judges felt this tool showcased outstanding technology that truly sets a new standard in the field.
SHORTLIST
AllSpice Actions Hardware DevOES – AllSpice.io
Lattice Propel – Lattice Semiconductor
Percepio DevAlert 2.0 – Percepio AB
Tracealyzer SDK – Percepio AB
AI Workbench – cloud-based environment to accelerate automotive AI software development and evaluation – Renesas Electronics
RDK3 development kit – Rutronik Elektronische
Bauelemente GmbH
Tessent RTLPro – Siemens EDA
The Embedded Kit, the production- and maintenance-ready operating system for embedded Linux systems – The Embedded Kit
Automotive Electronics Award
Winner – Renesas Electronics RAA279974 four-channel AHL video decoder
The decoder enables automotive manufacturers to deliver high-definition video over low-cost cables and connectors. The RAA279974 4-channel AHL video decoder supports single-ended, differential, and pseudo-differential analogue composite high-definition Automotive High-Definition Link video inputs. Its ability to process four input sources simultaneously makes it an economical solution for surround-view and multi-camera applications.
The judges described the decoder as robust and meeting the evolving needs of the automotive industry. Another comment was that it stands out as a highly innovative and practical solution for automotive video applications
SHORTLIST
10BASE-T1S MCU-less Ethernet to Edge Bus (E2B) technology – Analog Devices
ENNOVI-Net automotive 10GbES+ Ethernet connector – ENNOVI
Trust Anchor TA101 IC – Microchip
Micron 4150AT NVMe quad port SSD with SR-IOV – Micron
Molex MX-DaSH data-signal hybrid connector portfolio – Molex
Power System Product of the Year
Winner – Vicor Kitekraft flying wind turbine
The airborne system is 10 times more material-efficient, reduces the cost of wind energy by 50% and reduces the carbon footprint by more than 80%. The technology is based on scientific research carried out at TU Munich, providing a scalable solution for onshore and offshore use with a dramatically simplified value chain and high recyclability. Kitekraft’s demonstrator site is grid-connected with a paying customer.
The judges praised the innovation, potential impact and sustainability of the product.
SHORTLIST
SmartEgg technology – Eggtronic
ISG3202LA SolidGaN integrated half-bridge GaN IC – Innoscience
4.5 kW AI server power reference design – Navitas Semiconductor
G9KC, four-pole high power PCB relay – Omron Electronic Components Europe BV
qGaN technology – QPT
QSiC 1200V MOSFET modules – SemiQ
xG26 family of wireless SoCs and MCUs – Silicon Labs
Hypertac Green Connect hyperboloid high power contact technology – Smiths Interconnect
HPF3K0 series of AC-DC power supplies – XP Power
Smart Building of the Year
Winner – GSS CozIR-Blink CO2 sensor
The CozIR-Blink is a solid-state non-dispersive infrared sensor calibrated to measure concentrations of CO2, which absorbs the mid-IR 4.25µm wavelength of light. The judges said its power efficiency is key, with energy consumption measured in µW levels in active mode. The efficiency enables systems to operate on batteries for up to a decade or to run from energy harvesting systems. Accuracy level is ±50 ppm ±3% of reading, providing reliable data for effective HVAC control.
The judges also congratulated the design for demonstrating innovation in energy efficiency and smart building integration.
SHORTLIST
Highly commended
FG28 sub-GHz wireless + 2.4 GHz BLE SoC by Silicon Labs
NeoMesh wireless mesh network technology – NeoCortec
SC1320A Nessum communication IC – Socionext Europe
Passive/Interconnection Product of the Year
Winner – Omron G9KC four-pole high power PCB relay
The relay for AC wall boxes is designed for use with three-phase EV charging installations. It has extremely low contact resistance, reducing the heat inside the wall box, improving charging speed and also reducing strain on electronic components. Its high-power density facilitates more compact designs.
Designed to the highest Japanese standards the relay makes an effective contribution towards reducing heat dissipation and improving charge cycle efficiency and charger durability. This enables charger manufacturers to design faster, smaller and more efficient chargers to meet the needs of the rapidly growing EV market.
SHORTLIST
AMT24 Absolute encoder series – Same Sky
EC1005P silicon capacitor – Empower Semiconductor
ENNOVI-Net Automotive 10GbES+ Ethernet connector – ENNOVI
MX-DaSH (Data-Signal Hybrid) connector portfolio – Molex
Parasitic element coupling device for Wi-Fi 6E and Wi-Fi 7 communication – Murata
OMC H19 fibre optic microprocessor shield for Arduino Uno – OMC (Optoelectronic Manufacturing Corporation)
ZL Series electrolytic polymer hybrid capacitors – Panasonic Industry Europe
Series 144 high-power reed relays from Pickering Electronics – Pickering Electronics
IHPT series haptic feedback actuators with immersion licences – Vishay Intertechnology
Manufacturer of the Year
Winner – Custom Interconnect
CIL brought fully on-line the UK’s largest semiconductor packaging facility in the last 12 months and qualified it to ISO9001, AS9100D and ISO13485 accreditations. That and its PCBA production areas are based in Andover UK. The company has a turnover of £31m and experienced 100% growth in the past three years, with another 100% growth planned in the next three years.
Its diverse customer base includes automotive SiC BEV, EV charging, drone eVTOL charging, web hub GaN power supplies, 5G RF packaging, aerospace, power generation medical and motorsport companies.
The judges praised the winner’s “impressive credentials” and commercial strategy and said the new packaging facility gives it a leadership position in the UK.
SHORTLIST
Highly commended
CamCare UK for Generations in Making
OMC (Optoelectronic Manufacturing Corporation)
Smiths Interconnect
Readers’ Choice Award: University Research Group of the Year
Winner – Nottingham Trent University Washable, stretchable electronics for medical wearables
The winning research project uses 4mm diameter elastomer fibres made from a long thin flexible PCB, helically wound along, and bonded to, the elastomer core, with its components facing inwards. This innovative design means strips of circuitry more complex than a single wire or printed component can be wound into a helix so that the entire circuit can stretch. The team has made prototypes with PCBs of different widths and helix angles around fibres of different diameters and physical properties.
This research has practical applications that promise to make a significant impact in the medical and healthcare fields.
SHORTLIST
Aston University – demonstration of 402Tbit/s data using commercial optical fibre
University of Bath – lactic acid sensor
Glasgow University – analogue IC packaging research
University of Leicester – space battery using radioisotope power technologies
Universities of Oxford and Oregon – scalable, no-laser qubit IC for quantum computing
Startup of the Year
Winner – Silverary
This startup with a multi-disciplinary team of semiconductor physicists and electronic engineers based in Manchester is revolutionising X-ray imaging by bringing colour to X-rays with a new generation of digital flexible detectors, enabled through a patented organic semiconductor ink, combined with flexible thin film electronics. Its first product, Digital X-ray Film, is a flexible detector that is transforming industrial non-destructive testing for radiographers who currently have no alternative to radiographic film.
The judges described it as a highly innovative company that is making significant strides in X-ray imaging technology and which shows great potential to continue leading advancements in its field.
SHORTLIST
Forefront RF
Phlux Technology
QPT
Rising Star Award
Winner – Dr Huan Li, power electronics application engineer Cambridge GaN Devices
Despite having been with Cambridge GaN Devices for only a little over a year, Huan Li (PhD) has taken over responsibility for benchmarking the company’s ICeGaN GaN power ICs against competing devices to prove their ruggedness and ease of use. He has also engaged with customers to solve specific issues they were experiencing – in one instance enabling a charger to run 20°C cooler than those with competing parts.
The judges said the winner’s technical and commercial achievements are remarkable for someone so early in their career and noted they were an outstanding individual with an impressive set of skills.
SHORTLIST
Olivia Jones – Axiom Manufacturing Services
Dr Kalparupa Mukherjee – CGD – Cambridge GaN Devices
Aimee Wyatt – Pragmatic Semiconductor
Júlio César Costa – Pragmatic Semiconductor
Wei Sam – SliEStream Engineering Design
Anthonin Verdy – Weebit Nano
The Futurist Award
Winner – GroundWaves Haptic sneakers
GroundWaves’ haptic sneakers feature a patented concentric-drive voice coil actuator and a proprietary user-based haptic calibration system. Users can feel ultra-low bass frequencies (5Hz-600Hz) for a tactile sensation synchronised with music for an immersive sound.
Potential uses for enhanced perception of sound and physical sensation are in gaming, virtual reality environments, fitness and sports – for rhythmic feedback or coaching instructions, medical rehabilitation to assist in therapies that require sensory feedback and in entertainment venues.
The judges commented that the design addresses an area not covered by current commercially available products and said it was clear this product had been spurred on by passion.
SHORTLIST
Highly commended
4.5kW AI server power reference design by Navitas
Semiconductor
I/O chiplet – Alphawave Semi
SAKURA-II edge AI platform – EdgeCortix
qGaN technology – QPT
SM2322 single chip controller for high-density portable SSDs – Silicon Motion
Sunseeker X7 robotic lawnmower – Sunseeker
Educational Support Award
Winner – Katalytik Educating Inclusive Engineering Leaders
Katalytik works with engineering students and higher education institutions. Over the past year it has partnered with engineering departments across the country, supported academics with how and what they teach, how to evolve and how to measure progress, and has directly helped more than 1,000 engineering students through its workshops – from undergraduates to PhDs – to improve their self-confidence and communication skills. Furthermore, Katalytik undertook a self-funded study project that resulted in a white paper on Conflict and Communication, which is designed to advance the industry.
The judges said the winner demonstrated a strong and impactful commitment to advancing engineering education, fostering inclusivity and developing leadership skills, with clear evidence of success.
SHORTLIST
Highly commended
CamCare UK for Generations in Making
An educational experiment with LEGO and Red Pitaya –
Red Pitaya
