Testing

Tektronix pushes performance of DSOs using digital signal enhancement techniques

Chief operating officer Bill Sullivan will take over as president and CEO from Ned Barnholt, who is retiring

Hardware test equipment is combined with test pattern generation software to speed fault finding in ICs

OMI's packaging test system works at automotive/military temperature ranges and with lead-free processing

Optical Metrology Innovations from Ireland has introduced thermo-mechanical strain measuring equipment for chip packaging. The vector field (below) indicates strain in a package cross-section. The Cork-based firm is using image correlation techniques to measure strain without the need to add a grid to the surface being tested. “It allows us to see incipient failures and/or minute cracks not picked up using ...

The UK's National Physical Laboratory has built an instrument to stress test lead-free solder joints

Synthesys Research launches telecoms tester that combines the attributes of an oscilloscope with a bit error rate tester

Tektronix developes power-efficient input isolation circuit

Basingstoke office to satisfy demand for 3G and smartcard testing

Agilent Technologies has taken a lead in the real-time oscilloscope race with the first 13GHz scope