Electronics Weekly
The VITA 93 standard is based on the QMC architecture for scalable, modular embedded systems.
It has been introduced to address the high-speed data processing requirements, combined with size, weight and power (SWaP) constraints of today’s mil-aero applications.
Previewing the mezzanine card standard at Embedded Tech Trends, Elma Electronics’ director of system products, Mark Littlefield (pictured), explained that VITA 93 is the same concept as the XMC standard but smaller and designed for rugged deployed applications. These include industrial, medical and scientific research, energy, manufacturing and transportation as well as AI/ML in aerospace and defence.
Its role of expansion I/O is to add computation, for example FPGAs and GPUs. It is also scalable. A single QMC card (PCIe x4 / 40 I/O) measures 26mm x 78.25mm and complexity increases with double, triple or quad card sizes with up to PCIe x 16 and 160 I/O. There are also varying stacking height options and the card can be mounted horizontally or vertically.
Robert Greenfield, director of marketing and business development at Acromag, added that VITA 93 allows a maximum 30W thermal power, to accommodate the power demands of FPGAs and GPUs. A heatsink is standard in all modules, he added, with air-cooled and conduction-cooled versions available.
VITA, the open standards body is expected to confirm the VITA 93 (QMC) mezzanine card standard this spring.
