Integrated circuits (ICs) form the backbone of modern electronics, enabling compact, high-performance devices for sectors like consumer electronics, telecommunications, and automotive systems. Recent advancements in IC design have led to the development of system-on-chip (SoC) solutions, enhancing the performance and functionality of smartphones, wearables, and IoT devices. As AI, 5G, and autonomous driving technologies continue to evolve, ICs remain pivotal in driving innovation. Companies are also pushing the boundaries of low-power, high-efficiency ICs to meet the growing demand for sustainability and smart devices across global markets.
Institute of Science Tokyo revealed advances to its BBCube 3D integration process at ECTC, the IEEE Electronic Components and Technology Conference. “These new technologies can help in addressing the demands of high-performance computing applications which require high memory bandwidth and low power consumption with reduced power supply noise,” according to the Institute. BBCube stacks a processor on top of a ...
Torex Semiconductor has created a nano-power dc-dc converter that can occupy only 7.7 x 3.1mm with all external capacitors – the necessary inductor is inside the device package. Called XCL108 and drawing 400nA quiescent current, it is a boost converter that will operate from inputs between 650mV and 5.5V – starting from anything above 1.6V. The device is a series, ...
Silanna Semiconductor has created a laser driver IC that can squeeze a 400W quad EEL (edge-emitting laser) module into 80mm2. SL2001 comes in a 14ball 1 x 3.5mm WLCSP (wafer-level chip-scale package) includes both a capacitor charging circuit and another block to dump that stored energy into the laser diode. Operating from a power source between 3 and 24V it ...
Toshiba is aiming at UART and SPI interfaces with three four-channel dual-supply level-translator-transceivers. “The bus transceivers support level-up and level-down voltage translation from either of their dual power supplies in bidirectional communication systems using signal voltages between 0.8V and 3.6V,” said Toshiba. “These devices have been designed without any restrictions on the on-off sequencing of power supply terminals Vcca and ...
Analog Devices has announced an embedded software development environment based on Microsoft’s Visual Studio code: CodeFusion Studio. “This is ADI’s first-ever fully integrated suite of software and security solutions,” according to the company. “CodeFusion Studio leverages a modern IDE [integrated development environment] and command-line interface, which incorporates configuration and profiling tools to simplify development on heterogeneous processors.” Initially it covers ...
Nanusens has demonstrated a mems digitally-tuneable capacitor for 5G and 6G RF front-ends, that is compatible with CMOS IC processing and can be integrated with circuitry. The Q-factor is above 100 at 1GHz, and the four-bit capacitor has a minimum capacitance of 450fF (30fF/capacitor) with them all off and tunes up to ~1pF – a capacitance ratio of 2.2 which ...
Today, microelectronics is moving at an incredible rate, particularly in the fields of EDA and design methodology, writes Ash Madni. It’s a wonderful time to invest energy in both if we are lucky enough to participate. However, we are human beings not automatons and consequently don’t instantly move in the direction of change when required. It takes us time to ...
Renesas has increased support for its first RISC-V-based general-purpose microcontrollers by integrating Segger’s Embedded Studio into version 1.1.0 of Renesas’ RISC-V Smart Configurator code generator for R9A02G021 group MCUs. Smart Configurator is a graphical tool that generates source code that will configuring peripherals such as timers, interfaces and interrupt controllers. In this case, the source code is ready to be ...
NASA, Texas Instruments and others in the space industry have created a qualification standard for using plastic packaged ICs in space: Qualified Manufacturers List Class P – QML Class P. “QML Class P was designed in league with NASA and other industry experts as a plastic packaging standard for space electronic,” TI told Electronics Weekly. The standard is based on ...
STMicroelectronics has introduced a precision digital current, voltage and power monitor with a an I3C bus interface. Called TSC1641, it has two 16bit ΣΔ converters at its inputs, allowing simultaneous measurement of current (LSB=2.5µV) and voltage (LSB=2mV). The measured voltage can be anywhere from 0 to 60V (65V abs max), and the two current terminals sense with either polarity across ...
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