Thermal

Melexis has created a 32 x 24 pixel far-infra-red sensor array that can photograph the temperature of objects at between -40 and +260°C. Dubbed MLX90642, it comes in a 9.3mm diameter four-lead TO39 through-hole package in two versions: a squat (5.7mm tall) 110° x 75° wide-view type (BCA suffix) and a taller (11.9mm) 45° x 35° narrow-view version (BCB). The ...

Cambridge-based GaN power module maker QPT has patented a modification to the heat path of bottom and top-cooled power assemblies. It is a “novel way to attach dies to the heat spreaders or substrates which are typically AlN [aluminium nitride],” according to the company, which is branding it qAttach. “This provides a much better way to conduct heat away from ...

Chomerics announced a cure-in-place thermal gap filler material that remains flexible after curing, at Elecronica today. CIP 60 offers 6W/mK conductivity, and cures to a Shore hardness of 50 (ASTM 2240 method). “This not only provides an alternative to hard-curing dispensable materials in electronics cooling applications, but also offers an improvement over standard application methods associated with thermal gap filler ...

Inelco Hunter is stocking low-profile printer mechanisms for ‘2inch’ thermal paper, from FCL Components. FTP-62GMCL173 (pictured) measures 76.2 x 20.4 x 36.3mm FTP-62GMCL473 adds a slim auto-cutter to the front and measures 80.5 x 34.8 x 45.6mm Formerly, the above are 58mm (±1mm) printers. There are also 60mm types, identified by adding an #01 suffix. Paper thickness can range across ...

Fluke has launched a pocket-sized thermal camera that plugs into mobile phones. It has a resolution of 256 x 192, a 25Hz frame-rate and a temperature range of -10 to +550°C (±2% or ±2°C). The camera has “real-time high and low temperature markers, with comprehensive temperature analysis for spot, line and area, supported with a thermal imaging app”, said the ...

Alpha and Omega has announced a double-side-cooled 100V 197A (25°C) mosfet in a 5 x 6mm DFN package. Called AONA66916, thermal resistance form the junction to the top and bottom surfaces is 0.5 and 0.55C/W respectively. “The top-exposed DFN 5×6 package shares the same footprint as AOS’ standard DFN 5×6 package, eliminating the need to modify existing PCB layouts,” said ...

Combining AI with thermal imaging can ‘flesh out’ pedestrians to improve automotive safety systems at day and by night, says Wade Appelman of Owl Autonomous Imaging. Why are automotive manufacturers interested in a technology that combines expensive, cumbersome thermal imaging and complex, computer-hungry AI to solve a straightforward problem such as pedestrian automatic emergency braking (PAEB)? The answer is because ...

UCLA researchers have made an electrically-controlled solid-state ‘transistor’ for thermal energy, with a heat-flow on-off ratio of >13:1 when controlled with a ±2.5V base bias at room temperature. The voltage-flow curve is almost a straight line, and operation at 1MHz has been demonstrated. “Precision control of how heat flows through materials has been a long-held but elusive dream for physicists ...

Chomerics is aiming its latest thermal interface gel at thin heatsink bonds. GEL 50TBL (TBL – thin bond line) offers 5W/m.K bulk thermal conductivity and, “at a minimum bond line thickness of 0.05mm, the apparent thermal conductivity exceeds 10W/m.K”, according to the company. However, “the material is primarily for thin bond lines and is not typically intended for use as ...

Chomerics has announced a thermal gap filler pad material with a conductivity of 8.3W/m.K and 40 Shore 00 hardness. “With the highest available thermal conductivity in its product family, ‘PAD 80’ maintains low compression forces and conformability between mating surfaces,” said Chomerics. “Very low compression force means the product will deflect under assembly pressure, minimising stress on components, soldered joints ...