IP adds Bluetooth High Data Throughput to IEEE 802.15.4 radio

Ceva has added Bluetooth High Data Throughput (HDT) to IEEE 802.15.4 for Zigbee, Thread and Matter in radio intellectual property aimed at TSMC’s FFC+ 12nm finfet semiconductor process.

“Ceva-Waves Links200 [is] the first turn-key multi-protocol platform IP to support next generation Bluetooth HDT,” claimed Ceva. “High Data Throughput mode more than doubles the speed of traditional Bluetooth, delivering up to 7.5Mbit/s.”

The IP is aimed at loss-less multi-channel audio streaming for wireless earbuds, headsets, smartwatches, smart speakers, TV wireless speakers, gaming peripherals, and car audio systems.

“For example, 5.1 or 7.1 surround sound systems will be able to provide home entertainment audio experiences, thanks to the multi-channel support enabled by Bluetooth HDT,” said Ceva.

The package pre-integrates necessary hardware, software and radio components, including RF, modem, controller, software stacks and profiles, for a radio compliant with Bluetooth 6.0, with Classic Audio, LE Audio and Auracast Broadcast Audio streaming.

Localisation features include direction finding (AoA/AoD) and channel sounding ranging, and a low latency mode for gaming supports up to 8kHz refresh.

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Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.