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DRAM

Dynamic Random-Access Memory (DRAM) remains essential in modern computing, offering high-speed data storage and quick access to system data in devices such as smartphones, laptops, and servers. Recent advancements in DRAM technology include higher density, faster speeds, and energy-efficient designs to support 5G, AI, and cloud computing applications. Key players in the DRAM industry continue to innovate, meeting the increasing demand for memory modules in next-gen electronics devices. As data-driven industries expand globally, DRAM’s role in high-performance computing and electronics development is more significant than ever.

JEDEC HBM4 high-bandwidth memory standard addresses next-gen AI, HPC

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Addressing the growing use of AI and high-performance computing, JEDEC has published a new high-bandwidth memory (HBM) DRAM standard: HBM4. It aims to improve the performance, efficiency, and scalability of the memory required to power the next generation of AI, HPC (high-performance computing), and graphics workloads. For example, the next generation AI training and inference systems. HBM4 With transfer speeds ...

Tariffs will decide H2 memory supply, demand and price

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The future course of U.S. tariffs will be the key factor shaping memory supply-demand and pricing  in H2, says TrendForce. The 90-day grace period has temporarily eased concerns about demand loss due to new tariff barriers, however lingering uncertainty over the direction of US trade policy has made  memory buyers more defensive — increasing  DRAM and NAND  inventory levels as ...

Q4 DRAM market grew 9.9%

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The Q4 DRAM market grew 9.9% topping $28 billion driven by rising contract prices for server DDR5 and concentrated shipments of HBM, reports TrendForce. Seasonal Q1 weakness and weakening CSP demand are expected to push prices lower in the current quarter, Samsung remained the top DRAM supplier with $11.25 billion in revenue—a 5.1% QoQ increase. Hynix was second with $10.46 ...

Fluctuating DRAM ASPs

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Q4 memory prices will see a significant slowdown in growth, with conventional DRAM expected to increase by only 0–5%, says TrendForce. However, the rising share of HBM will increase the DRAM ASP  by 8% to 13% which is a marked deceleration compared to the previous quarter. PC sales have had  a lacklustre Q3 and TrendForce anticipates that PC DRAM prices ...

DRAM surging

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Q2 DRAM revenues were  up 24.8% q-o-q  at $22.9 billion, says TrendForce. Q2 contract prices were up 13%–18%. Samsung saw a 17%–19% ASP with bit shipments also rising leading to revenue growth of 22% to $9.82 billion. SK hynix saw its bit shipments increase by over 20%—driven by the certification and mass shipment of its HBM3e products—resulting in a revenue ...

JEDEC plans advanced memory modules for next-gen AI applications

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JEDEC has unveiled its plans for advanced memory modules to enable future high-performance computing and AI applications. Specifically, the standards body has revealed details about its standards for DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6. The aim is to provide “unparalleled bandwidth and memory capacity”. Both projects are in development ...

Memory-Fest

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DRAM and NAND Flash revenues are expected to see 2024 increases of 75% and 77% respectively, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM, says TrendForce. Revenues are projected to continue growing in 2025, with DRAM expected to increase by 51% and NAND Flash by 29%, reaching record highs. DRAM ASPs ...

JEDEC publishes new CAMM2 memory module standard

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JEDEC has published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard, which defines the electrical and mechanical requirements for Compression-Attached Memory Modules. It covers both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s). The standards body highlights that DDR5 and LPDDR5/5X ...

Micron samples 9.6Gbit/s LPDDR5X memory for Snapdragon 8 Gen 3

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Micron Technology is shipping samples of its LPDDR5X (low-power double data rate 5X) memory for use with Snapdragon 8 Gen 3 – Qualcomm’s new flagship processor for phones. “Running at the world’s fastest speed grade of 9.6Gbit/s, Micron LPDDR5X provides the mobile ecosystem with the performance needed to unlock generative artificial intelligence at the edge,” claimed Micron. This speed compares ...

Q2 DRAM revenue up 20.4% q-o-q

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Q2 revenue for the DRAM industry grew 20.4% q-o-q to $11.43 billion, ending a decline that persisted for three consecutive quarters, reports  TrendForce, as  the Big Three saw shipment growth from AI servers driving growth in HBM shipments and DDR5 inventory stocking. SK hynix saw a significant quarterly growth of over 35% in shipments. The company’s shipments of DDR5 and ...