Toshiba adds four-pin SiC mosfet to cut losses

Toshiba has picked a four-pin package for its latest third-generation silicon carbide mosfets.

Toshiba TO-247-4LX package

“Devices in the TWxxxZxxxC series are the first Toshiba SiC products to be housed in a TO-247-4L(X) package with a fourth pin,” according to the company. “This allows the provision of a Kelvin connection of the signal source terminal for the gate drive, thereby reducing the parasitic inductance effects of the internal source wire and improving high-speed switching performance.”

Selecting the new TW045Z120C, it is said to have ~40% better turn-on loss and ~34% turn-off loss compared with its existing three-pin TO-247 TW045N120C.


Within TWxxxZxxxC, there are five 650V and five 1200V mosfets, with typical drain-source on-resistance ranging from 15mΩ to 140mΩ. “Combined with low gate-drain charge values, it will enable low losses even in high frequency applications,” is claimed. Maximum continuous drain currents within the family is 100A.


Toshiba 4pin TO-247 mosfet switching onSwitch-on with three or four pin packages (800Vdd, 20A Id, 0-18Vgs, 4.7Ω Rg, 25°C, 100μH load)

Picking the 1.2kV TW045Z120C mentioned, this is a 40A (25°C, 30A continuous or 82A pulsed at 100°C), 45mΩtyp (67mΩtyp 150°C) device.

Gate drain charge is 8.9nC, gate-source charge is 21nC, and total gate charge is 57nC.

Toshiba 4pin TO-247 mosfet switching off

And switching off

Reverse recovery charge and time are 297nC and 54ns, with a current peak of 11A (800V, 13A, 1kA/μs, Vg=0V).

The package is rated for up to 182W and the channel can run up to 175°C – channel to case resistance is 0.824°C/W.

Industrial switching PSU applications are foreseen for the family, in servers, data centres, electric vehicle chargers, photovoltaic inverters and uninterruptible supplies.

Find the TW045Z120C product page here

Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.

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