Six accelerometers in sports IMU (and three gyros)

ST has integrated six accelerometers into a 2.5 x 3mm inertial measurement unit for sports wearables.

STM LSM6DSV80X 6 acc 3 gyro IMU graph

“Capable of measuring events ranging from slight movements to intense impacts with equal accuracy,” said ST. The “low-g sensor provides high accuracy with limited range [and the] high-g sensor offers an extended range with less accuracy”.

Packaged in a 0.86mm thick LGA and called LSM6DSV80X, it has up-to-16g accelerometers for the low range and up-to-80g accelerometrs for the high range, plus three gyroscopes that work up to 4000degree/s.


STM LSM6DSV80X 6 acc 3 gyro IMUAccording to the company, tennis accelerations peak at 45g, volleyball and boxing at 60g, and plyometrics at 75g. Walking, running (except downhill) and gestures are all within the range of the 16g sensors.


STM LSM6DSV80X 6 acc 3 gyro IMU blockOn-board digital processing is included for sensor fusion, and a “machine learning core and finite state machine provide edge processing in the sensor to boost performance and save power”, said ST. “By processing the raw data locally, the IMU can recognize wearers’ activities autonomously and simplify host communications for sharper responses and lower power consumption. The sensor also features adaptive self-calibration to adjust for different activity scenarios.”

Consumption is 0.80mA in nine-axis ‘combo high-performance’ mode, dropping to 0.67mA if only six axis are enabled. Analog supply voltage is 1.71 to 3.6V, and it needs 1.08 to 3.6V for its IO – data is available over a choice of I2C, SPI or I3C busses.

I2C can also be used to bring data from further sensors onto the device.

For development, the part has been added to MEMS-Studio, and an adapter board will be available to drop the sensor into several of the company’s dev boards.

Samples are available, with production scheduled by the end of April.

Steve Bush

Steve Bush is the long-standing technology editor for Electronics Weekly, covering electronics developments for more than 25 years. He has a particular interest in the Power and Embedded areas of the industry. He also writes for the Engineer In Wonderland blog, covering 3D printing, CNC machines and miscellaneous other engineering matters.

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