Electronics Weekly
At there heart are Intel 13th generation Core H, P or U series processors, enabling “system designers to pick from a variety of energy efficient and performance options scaling up to fourteen cores and twenty threads at 15 to 35W thermal design power”, according to Tria.
Alongside the CPUs sit Intel Iris Xe graphics engines with up 96 execution units that can also accelerate AI-intensive tasks.
Soldered-in memory is up to 64Gbyte with in-band ECC, and ther is an option of local NVMe storage.
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IO includes PCI Express Gen 4, USB4, USB3.2, USB2.0, dual Gbit/s Ethernet, MIPI-CSI, SATA, and serial ports.
Up to four independent external displays can be connected via DDI, eDP and USB4 interfaces.
Tria products are designed and manufactured in Germany.
The COM-HPC Mini modules will be on stand 225 in Hall 3A at Embedded World next week in Nuremberg.
