heatsink

Researchers at the University of Illinois Urbana-Champaign are investigating phase-change as a way to improve heat-sinking in space. Earth-bound heatsinks loose most of their heat by convection – a luxury not available to heatsinks on satellites which can only use radiation. And spacecraft heatsinks cannot be heavy. The research project is looking into situations were heat is not generated continuously, ...

Pushing back against ever hotter computer-on-modules, Congatec is offering heat-pipe based heatsinking, using acetone as a working fluid to accommodate sub-0°C switch-ons – operation is over -40 to +85°C. “Acetone cooling will become an option for the conga-TC675 and conga-TC675r,” the company told Electronics Weekly. “Most likely, they can be ordered off-the-shelf by Q3 – the acetone coolers themselves are ...

Cambridge-based GaN power module maker QPT has patented a modification to the heat path of bottom and top-cooled power assemblies. It is a “novel way to attach dies to the heat spreaders or substrates which are typically AlN [aluminium nitride],” according to the company, which is branding it qAttach. “This provides a much better way to conduct heat away from ...

Chomerics has formulated a thermal gap pad with low oil bleed, low oil migration “ideal for use where the appearance or production issues of silicone oils are undesirable, according to the company. ‘Pad 80LO’ (LO = low oil) has a typical thermal conductivity of 8W/mK and Shore 00 hardness of 60. Stress relaxation over time is nearly 90% reduction in ...

Iceotope Technologies has opened a liquid cooling lab at its headquarters in Sheffield, built with Efficiency IT. Intended to test CPU and GPU coolers, as well as cooling components such as manifolds, it has two temperature-controlled test rooms. “We can run full rack level testing to simulate a liquid cooled data centre environment,” the company told Electronics Weekly. “We have ...

Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...

EPC is claiming “the lowest on-resistance GaN FET on the market” for its 1mΩ 100V EPC2361, which comes in a 3 x 5mm QFN package with top and bottom cooling. 1mΩ is at 50A 25°C with 5V on the gate, and rises to ~1.8mΩ at the max operating temperature of 150°C (minimum is -40°C). The preliminary data sheet has no ...

Alpha and Omega has announced a double-side-cooled 100V 197A (25°C) mosfet in a 5 x 6mm DFN package. Called AONA66916, thermal resistance form the junction to the top and bottom surfaces is 0.5 and 0.55C/W respectively. “The top-exposed DFN 5×6 package shares the same footprint as AOS’ standard DFN 5×6 package, eliminating the need to modify existing PCB layouts,” said ...

CUI has introduced a range of ac fans with air flows 45 and 165CFM Across the 26 member CAF family there are three frame sizes – 120 x 120mm square either 26 or 38mm thick, and or 172mm circular (truncated to 150mm in one dimension) which is 51mm thick. Frames are aluminium, impeller is polymer (PBT, UL94V-0), and there is ...

Frore Systems is developing a thin flat device cooler that pumps an airflow without using a fan. Called AirJet, it comes in two versions: Mini 27.5 x 41.5 x 2.8mm Removes 5.25W from IC with 85°C die Consumes 1W 1750 Pascals pressure 0.21 CFM flow 21dBA sound output Pro 31.5 x 71.5 x 2.8mm Removes 10.5W from IC with 85°C ...