Package

ChEmpower, a supplier of chemical solutions for wafer planarisation, has raised $18.7 million in Series A funding. The funding will help scale its technology for advanced chip manufacturing and packaging. The funding round was co-led by M Ventures and Rhapsody Venture Partners. New and existing investors Intel Capital, Pangaea Ventures, Foothill Ventures, In-Q-Tel (IQT), and TEL Venture Capital also participated ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly,” according to the company. “Additionally, this leads to improvements in curing time and minimises energy consumption.” FOWLP is a set of wafer-level integration techniques where a wafer ...

Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...

Renesas Electronics is part of a consortium building an OSAT (outsourced semiconductor assembly and test) facility at Sanand near Ahmedabad in Gujarat India. It will only hold around 6.8% of the equity capital, with the bulk going to Mumbai engineering conglomerate CG Power and Industrial Solutions. Thailand OSAT provider Stars Microelectronics will hold 0.9%. “CG’s entry into the semiconductor manufacturing ...

NASA, Texas Instruments and others in the space industry have created a qualification standard for using plastic packaged ICs in space: Qualified Manufacturers List Class P – QML Class P. “QML Class P was designed in league with NASA and other industry experts as a plastic packaging standard for space electronic,” TI told Electronics Weekly. The standard is based on ...

Infineon has put 650V mosfet die from its CFD7A portfolio into a surface-mount package with “improved electrical performance over the well-known TO247 through-hole devices, thus enabling efficient energy utilisation in onboard chargers and dc-dc converters”, it said. ‘QDPAK TSC’ is a top-side-cooled package (see images) announced earlier this year and now registered with JEDEC – at the same time it ...

Toshiba has launched a 200A 40V 0.66mΩmax automotive grade n-channel mosfet that can handle 600A pulses in a 7 x 8.44 x 2.3mm gull-wing package. “Automotive safety-critical applications such as steering, braking and autonomous driving systems generally require more devices than other systems to meet redundancy requirements. Here, a power mosfet with high current density is required due to the ...

Laird Thermal Systems has created a series of multi-stage thermo-electric coolers for miniature optical packages. MSX Series have cold-side footprints down to 2 x 4mm, and thicknesses down to 3.3mm for two stages, 3.8mm for three stages and 4.9mm for four-stage coolers. It has the “capability to integrate them into various optical packages, including TO-39, TO-46 or TO-8”, according to the ...

Toshiba has created a gull-wing mosfet package specifically for high current automotive applications, and has released a 400A 40V mosfet in it. Branded L-TOGL and measuring 9.9 x 11.8 x 2.3mm (right), the AEC-Q101-capable package is designed for up to 175°C, 100V, 400A, 750W, with minimum mosfet device Rds(on) around 300μΩ. This compares with 250A, 372W and ~740μΩ from the ...

Alter Technology has started its plastic die packaging line in Livingston. “We have set up the UK’s only QFN plastic package semiconductor line, which has a capacity of several million single die QFN-equivalents per year, with plans to go beyond 10 million next year,” said company CEO Stephen Duffy. “While still a long way off the capacity of the big ...