Cable assemblies keep a low profile under cooling hardware

Exhibiting a low mated height of 4.35mm, the Si-Fly LP (low profile) cable-to-board assemblies have been released by Samtec for use in data centre, HPC and AI applications. Typically in these areas the z-axis height near the IC package is limited.

Samtec Si-Fly cable assemblies

In addition to side-to-side and front-to-back mounting, the assemblies allow belly-to-belly PCB mounting (connectors and cages on both sides of a PCB) near the IC package, to reduce board space and for secure placement under heat sinks or other cooling hardware.

Each cable assembly provides 112Gbps PAM4 channel rate in a two-row, 16-pair design with aggregate data rates of 896Gbps (x8 bi-directional) or 1.79Tbps (x16 uni-directional). Each is PCIe 6.0/CXL 3.2-capable. Signals are routed through high-density, high-performance flyover cable to reduces thermal challenges, said Samtec. They also simplify board layout and eliminate the expense of retimers, reduce the number of board layers and allow for less expensive PCB materials, explained Samtec.


The company works with system architects to create cable management and thermal load distribution for each design. The cable assemblies feature Samtec’s proprietary 34 AWG, 92-Ohm low-skew Eye Speed twinax cable which uses co-extrusion to optimise symmetry between signal conductors and shielding to optimise signal integrity for low intrapair skew.


 

Caroline Hayes

Caroline Hayes

Caroline Hayes is the editor of Electronics Weekly. She has been covering the electronics industry for over 30 years, edited UK and pan-European titles and contributed to UK and international online and print publications. Although specialising in the semiconductor market, she also has a keen interest in education, careers and start-up opportunities in the broader electronics industry.

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