Bosch extends Arrow agreement for automotive components in EMEA

Bosch has signed Arrow Electronics to distributes its automotive semiconductor components in EMEA, building on an existing agreement for North America.

Automotive sensors

The agreement extends to Bosch‘s MEMS sensors, asics and SiC chips.  “We are convinced that automotive manufacturers and suppliers in Europe will benefit from our co-operation,” said Philipp Schäfer, senior vice president, sales at Bosch Mobility Electronics.

Two generations of Bosch SiC chips are available, the latest of which has “very low on-resistance over the entire temperature range”. They are available as bare die and as packaged discrete chips.


The agreement also encompasses asic components and gate drivers available for SiC chips with intelligent control for electric vehicles.


Bosch manufactures more than four million MEMS sensors every day. The company says around one in three of the 20 MEMS sensors installed in a typical vehicle today is from Bosch.. Its portfolio includes acceleration, rotation rate, and pressure sensors to detect motion in adaptive chassis control and ensure that airbags are released appropriately. There is also an integrated Bluetooth low-energy sensor solution for tyre pressure monitoring with “minimal power consumption”.  The offering also includes sensors for ‘road noise cancelling’, condition monitoring of machines and equipment, and the latest generation of inertial sensors for navigation applications.

 

Caroline Hayes

Caroline Hayes

Caroline Hayes is the editor of Electronics Weekly. She has been covering the electronics industry for over 30 years, edited UK and pan-European titles and contributed to UK and international online and print publications. Although specialising in the semiconductor market, she also has a keen interest in education, careers and start-up opportunities in the broader electronics industry.

Leave a Reply

Your email address will not be published. Required fields are marked *

*