Stanley has introduced a tiny screw and thread pair (known as a micro-fastener) for waterproof and vibration-proof wearables and portables.
Manufacturing
Thailand firm buys UK manufacturer Exception to enter Europe
UK-based electronics manufacturer Exception EMS has been acquired by Fabrinet, the global EMS company with headquarters in Thailand.
Innovate UK funds compound semiconductor research
Innovate UK is to invest up to £4m in new projects that help to speed up the use of compound semiconductors.
Hampshire computer firm invests for IoT growth
Hampshire-based single board computer manufacturer BVM has expanded its design and manufacturing facilities with a substantial investment in both people and equipment. The firm has added design resources such as the latest Solidworks 3D modeling software for system design and Altium PCB layout and design software capable of handling the latest high speed PCIe signals with impedance matched tracks. “A ...
Synopsys joins GloFo FD-SOI FDXcelerator programme
Synopsys has joined the GloFo's FDXcelerator Partner Program, an ecosystem designed to facilitate 22nm FD-SOI (FDX) SoC designs.
GloFo launches 12nm FD-SOI at Dresden
Globalfoundries launches its 12nm FD-SOI semiconductor technology, called 12FDX, offering the industry’s first multi-node FD-SOI roadmap.
UK tech firms 3D print a mountain bike
High tech and anthropometry come together in a mountain bike frame designed and manufactured in the UK.
UK firm gets €1.8m from EU to develop flexible displays for Asia
A €1.8m EU grant has been awarded to SmartKem of the UK for technology transfer its organic semiconductor technology to flexible display makers in Asia. SmartKem is investing €850k in the project which it said will help drive the adoption of organic semiconductors as a universal thin film transistor (TFT) backplane platform for the mass manufacture of flexible and curved ...
Korea develops roll-based packaging for flexible silicon ICs
Korean process engineers have developed a chip packaging technology that creates flexible integrated circuits. The process starts with a flash memory wafer diced after thinning to ~100nm. These die are attached to a plastic carrier film, which allows them to be transferred to a roller and pressed onto a flexible PCB supported by a flat plate. The team suggests tolerance ...
Dialog enters GaN market
Dialog will start sampling GaN power ICs in Q4 with a fast charging power adapter made on TSMC’s 650-volt GaN-on-Silicon process technology. The DA8801 together with Dialog’s patented digital Rapid Charge power conversion controllers will enable more efficient, smaller and higher power density adapters compared to traditional Silicon field-effect transistor (FET) based designs, says the company. Dialog is initially targeting the ...