Manufacturing

JEDEC has published a new release of the JEP30 Part Model Guidelines, including reference documents and related XML Schema files. Working in collaboration with the Open Compute Project Foundation (OCP), the electronics standards body says it has combined the capabilities and open standards of OCP’s Chiplet Data Extensible Markup Language (CDXML) into its JEP30 Guidelines. In prospect, it suggests, is ...

Connector distributor Lane Motorsport has hosted Loughborough University student racing car development team (LUMotorsport) at its Sussex manufacturing facility. “We have been supporting LUMotorsport with their design efforts for a number of years, and it was gratifying to meet the 2024 team and show them where the magic happens,” said Lane director Nick Wheeler. “Lane Electronics is a family-run electrical ...

Specialist electric car maker The Little Car Company is celebrating three years since it delivered its first vehicle. The company creates slightly scaled down versions of classic vehicles, powered by electric motors rated at up to 28kW. So far is has delivered 400 vehicles to over 50 countries, spread between its Bugatti Baby II, Aston Martin DB5 Junior and Ferrari ...

Die-bonding at up to 60,000 flip-chips per hour, is what ITEC is claiming for its ADAT3 XF TwinRevolve. “Instead of the traditional forwards and backwards up-down linear motion, the new die bonder employs two rotating heads to pick, flip and place the die in a fast, smooth action,” according to the company. “This mechanism reduces inertia and vibration, allowing for the ...

X-Fab has turned to Soitec wafers to offer silicon carbide foundry services from its fab in Lubbock Texas. The 150mm wafers, called ‘SmartSiC’, are made from a thin layer of mono-crystalline SiC, cut from a thick SiC donor wafer, bonded to a low-resistivity polycrystalline siclicon carbide ‘handle’ wafer – up to 10 thin mono-crystalline wafers can be cut from each ...

X-FAB Silicon Foundries SE, the analogue/mixed-signal and speciality foundry, has updated its XP018 high-voltage CMOS semiconductor fabrication platform with new 40V and 60V high-voltage primitive devices, which feature an extended SOA for improved operational robustness. These 2nd generation high-voltage primitive devices exhibit up to a 50% reduction in RDSon figures compared to the previous version. This offers an alternative which ...

ABB has opened a €20m injection molding manufacturing site at Evergem, near Ghent in Belgium, replacing an existing facility acquired with GE Industrial Solutions in 2018. The site will produce residential, commercial and industrial power distribution enclosures for circuit breakers, fuses, switches and meters. Evergem is part of ABB’s initiative towards reducing its greenhouse gas emissions, according to the company, ...

Rogue Valley Microdevices, the Oregon pure-play MEMS foundry, has announced that its second 50,000-square-foot fab, currently under construction on the “Space Coast” of Florida will be 300mm capable and running wafers in 2025. The company claims it will be the first pure-play foundry with 300mm capability. “With Rogue Valley Microdevices’ investment in 300mm MEMS capability at our new Palm Bay, ...

Segger has made a four channel version of is Flasher Hub production IC programmer to save space on the production floor. ‘Flasher Hub-4’ is a compact version of Flasher Hub-12, measuring 125 x 78 x 25mm. “It is just a little bigger than a standard deck of cards, making it the most compact and efficient control unit on the market ...

Professor Mike Capaldi, dean of innovation and business at Newcastle University, is to be the Chair of UK power, electronics, machines and drives (PEMD) manufacturing network DER-IC. Funded by Innovate UK, the network offers access to equipment, facilities and expertise from the PEMD manufacturing supply chain. Capaldi is returning to the network having lead the initial funding application and development ...