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Wafer

Wafers are the foundation of semiconductor manufacturing, where process nodes, materials, and fabrication technologies define chip performance. Innovations in 3D stacking, SOI wafers, and GaN/SiC substrates are expanding design possibilities for power electronics, RF, and high-speed logic. Wafer-level packaging (WLP) and foundry advancements are also transforming system integration. Wafer news delivers critical updates for professionals tracking the evolution of fabrication processes, supply chain capacity, and materials science in the global chip industry.

Soitec and PSMC hook up for TLT wafers

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Soitec, the French wafer manufacturer, has announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at the wafer level. This marks the first public announcement of Soitec’s TLT technology. The technology is an enabler ...

$22m series-E for IceMos

IceMOS founder chairman Samuel Anderson

Power mosfet and wafer-maker IceMos Technology has pulled-in $22m of series-E funding, including $7.5m from 57 Stars, and money from un-named “earlier stage USA investors” and a “London-based investor”, said IceMos Headquartered in Arizona, IceMos has manufacturing in Northern Ireland, research in Arizona and a design center in Tokyo. Its wafer products include active layers attached to handle wafers using ...

Lasers cut diamond into more useful wafers

Chiba University diamond wafer slicing

Chiba University has found a way to cut blocks of diamond into thin wafers along a difficult but desirable crystal plane using lasers. The ‘100’ plain leaves a surface that is relatively easy to planarise and etch for semiconductor use, according to the Chiba researchers, but diamond wants to crack along its 111 plane, so any crack-based separation starting in ...

ST’s first 200mm in-house SIC wafers

ST 8in SiC wafer

STMicroelectronics has manufactured its first 200mm silicon-carbide bulk wafers at its Norrköping Sweden facility. “The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition towards electrification,” said ST president of automotive Marco Monti. The company is claiming high quality with minimal crystal-dislocation defects through expertise in SiC ingot growth technology ...

ST signs up for more Cree silicon carbide wafers

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ST Microelectronics has extended its multi-year silicon carbide wafer deal with Cree, taking it to over $500m in total value. Cree will supply 150mm bare and epitaxial silicon carbide wafers to ST over “several years”, according to Cree. “Expanding our long-term wafer supply agreement with Cree will increase the flexibility of our global silicon carbide substrate supply,” said ST CEO Jean-Marc ...

Consumer Looking Good

Apart from PC which is falling fast and expected to be weak for a couple more years, the trend for cosumer electronics looks good.

FD-SOI appeals to ARM

ARM is enthusiastic about the potential of FD-SOI – STMicroelectronics’ process which is getting massive backing from the French government.

ARM Fancies FD-SOI

ARM is enthusiastic about the potential of FD-SOI – STMicroelectronics’ process which is getting massive backing from the French government.