Electronics Weekly
Four fabs costing $46 billion are either underway or planned at TI’s Texas fab sites in Sherman (pictured) and Richardson which is being expanded.
They are Fabs SM1 and SM2 (already underway) and SM3 and SM4 which are to be built later at an unspecified date..
Three fabs costing $15 billion will be built at TI’s Utah site at Lehi.
Five of the seven fabs had been announced before. The two new additions are SM3 & SM4.
“TI is building dependable, low-cost 300mm capacity at scale to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system,” said TI CEO Haviv Ilan.
TI was awarded up to $1.6 billion in direct funding under the Chips Act to support the building of three fabs at a cost of $18 billion plus up to $3 billion in federal loans and $6–8 billion in investment tax credits.
“For nearly a century, Texas Instruments has been a bedrock American company driving innovation in technology and manufacturing,” said U.S. Secretary of Commerce, Howard Lutnick. “our partnership with TI will support U.S. chip manufacturing for decades to come.”
The seven fabs will produce ‘foundational’ chips says TI, which appears to mean legacy/mature node/trailing edge ICs
