The latest news, developments and announcements from around the electronics industry.
The European Space Agency (ESA) is exploring ways to increase the resilience of Global Navigation Satellite Systems (GNSS). To this end, it has signed an agreement with Leonardo to research and develop Machine Learning (ML) techniques to help better steer antenna arrays to block out unwanted signals. CRPA External interference, such as jamming and spoofing, increasingly threatens to disrupt access ...
Designers looking to optimise PPA (power, performance, area) are finding that optimisation engines can render original programmatic timing constraints unusable in their original form. At DAC 2025, Ausdia introduced Timevision OneSource which automatically generates a new version of block-level constraints after optimisation engines have worked on hierarchies, duplicate elements and performed advanced transformation. Such optimisations can save two weeks of ...
Rohm has created a set of six current sense amplifiers with AEC-Q100 qualification for automotive use. They work with external shunt resistors, and there are two basic types: one (BD1423xFVJ-C) that can sense across the common-mode range of -14 to +80V and runs from 2.7 to 18V, and the other (BD1422xG-C) that can sense across -14 to +40V and runs ...
TDK is challenging quartz accelerometers in down-hole measure-while-drilling applications with a ±14g MEMS accelerometer that works across -30 to +150°C. With a “unique closed-loop architecture that provides an unprecedented level of vibration rectification and resistance to operational shocks, AXO315T0 exhibits a bias residual error of 0.8mg over its operating temperature range, enabling a precise and continuous inclination measurement for directional ...
San Francisco: At last year’s DAC, Baya Systems emerged from stealth mode. At this year’s event, the design software company announced a switch fabric technology that is claimed to enable a x100 increase in node density. NeuraScale is designed to overcome critical scaling and data movement challenges in AI infrastructure that are driving advanced SoCs and emerging 3D chiplet-based designs, ...
If the foundry industry is defined as including packaging and mask making as well as front end, then TSMC is No,1 with 35% market share and Intel No.2 with 6.5%, says CounterPoint Research. The extended definition is referred to as Foundry 2.0 and was, allegedly adopted by TSMC because it puts the company on safer ground if anyone starts monopoly ...
Nordic Semiconductor has bought Memfault, the cloud platform connectivity provider, for $120 million giving Nordic a comprehensive hardware/software system for connected products. The combination is expected to enable continuous software upgrades throughout a product’s lifecycle, strengthened security, better performance, lower power consumption, and higher functionality. Memfault is a platform provider for device observability and management and secure OTA software updates ...
BlackSky Technology, a real-time space imagery specialist, is expanding its current high frequency monitoring constellation – Gen-3 – with multispectral, large-area collection satellites. Dubbed AROS, the new satellites will support country scale digital mapping, navigation, and maritime applications, said the company. Specifically, the new satellite design will support dynamic broad area search, change monitoring, and predictable refresh of large area ...
Kioxia is sampling CD9P Series PCIe 5.0 NVMe SSDs built with TLC-based 3D flash memory. BiCS flash uses CBA (CMOS directly Bonded to Array) technology which boosts power efficiency, performance, and storage density while doubling the capacity available per SSD compared with the previous generation model. The CD9P Series drives deliver 4-corner performance improvements of up to approximately 125% in ...
Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025. The Innovator3D IC suite advances 3D IC integration using AI to execute chip design and raise productivity, as designers increasingly reintegrate chiplets into high performance substrates, said the company. It enables IC ...
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