Farnell has broadened its portfolio of components tailored for mission-critical industries. Customers designing for mission-critical projects can benefit from a 10% discount to all qualifying SIC code holders or defence, aerospace and marine procurement departments or contractors for orders submitted before 30 September 2025. The offer is valid throughout EMEA. Farnell’s offerings of components for aerospace, defence and marine applications ...
News
The latest news, developments and announcements from around the electronics industry.
40% of Agentic AI projects will be cancelled by 2027
Over 40% of agentic AI projects will be canceled by the end of 2027, due to escalating costs, unclear business value or inadequate risk controls, according to Gartner. “Most agentic AI projects right now are early stage experiments or proof of concepts that are mostly driven by hype and are often misapplied,” says Gartner’s Anushree Verma, “this can blind organizations ...
Muon Space raises $146m Series B to expand satellite production
Muon Space, the small satellite specialist, has announced the closure of its oversubscribed $89.5 million Series B1 funding round. The investment was led by Congruent Ventures with existing investors including Activate Capital, Acme Capital, Costanoa Ventures, and Radical Ventures. ArcTern Ventures was a new participant. The round comprises $44.5 million in equity and $45 million in credit facilities The latest ...
28 x 38mm i.MX 8M embedded computing modules
Diamond Technologies has introduced a series of 28 x 38mm embedded computing modules based around NXP’s i.MX 8M processors, which combine Arm Cortex-A53 and Cortex-M cores. Initial boards are: DTI 8M Plus Quad with NXP i.MX 8M Plus up to four 1.8GHz Cortex-A53 800MHz Cortex-M7 Neural processing unit 1GHz GC7000UL 3D graphics GC520L 2D graphics 1080p60 video decode 1080p60 video ...
15W radiation-rated dc-dc for space
Microchip has introduced a 15W radiation-rated dc-dc converter for space use. Intended to be fed from a satallite’s 28V bus (22V to 42V, 50V abs max), SA15-5-5T has three isolated 5V 1A outputs that can be paralleled for more current or connected in series for higher voltages. Output ripple is <1%, and operation is over-55 to 125°C, with de-rating above ...
Arrow to distribute TDK-Lambda across Europe
TDK has selected Arrow as its first pan-European distributor for TDK-Lambda products. “This alliance with Arrow Electronics complements TDK-Lambda’s existing distribution agreements in the EMEA region, providing an integrated service through Arrow’s dual capability in logistics and design-in,” said TDK. Arrow will provide design-in support through its field application engineers across EMEA, as well as its power market development engineers. ...
ZVS GaN PFC chip switches at 2MHz
Wise Integration has released its GaN PFC (power factor correction) controller chip to production. WIW1101 is based on a 32bit MCU, said the company, and is specifically for totem pole PFCs operating in critical conduction mode (CrCM), switching at up to 2MHz and delivering between 100W and 1.5kW. Its proprietary internal algorithm “enables ZVS [zero voltage switching] across all power ...
Panmesia launches Link Solution for datacentres
Panmnesia, the Korean CXL specialist, has brought out its Link Solution product line-up for AI infrastructure. The line-up encompasses the entire technology stack required for AI infrastructure design, including hardware, silicon IPs, network topology, and software. By delivering cross-stack optimization, Panmnesia’s Link Solution significantly reduces communication overhead and enhances overall system performance. The Link Solution supports a wide range of ...
75th ECTC packaging themes
Packaging had some well attended Special Sessions at the 75th ECTC of which these three were particularly popular: 1.Advanced Materials for Enabling Co-Packaged Optics (CPO) Integration. CPO is emerging as a solution to meet computing/communication demands for high bandwidth at low power. Mark Gerber from ASE gave an overview of the system requirements that are driving CPO material considerations, ...
China to have 30% of foundry capacity by 2030
Foundry capacity is forecast to grow at 4.3% CAGR from 2024 to 2030, says Yole, with mainland China to lead in foundry capacity by 2030, with 30% of global share. The US currently accounts for 57% of wafer demand but owns only 10% of foundry capacity. Global foundry utilisation will remain at about 70%, with growth heavily dependent on demand. ...