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EDA

Electronic Design Automation (EDA) tools are essential for PCB design, circuit simulation, and IC layout. With advancements in EDA software, engineers are able to optimize design workflows, improve design accuracy, and accelerate product development. As demand for AI-driven design tools, high-frequency circuit simulation, and automated layout solutions grows, EDA technologies are transforming industries such as telecommunications, automotive, and consumer electronics. Innovations in cloud-based EDA tools and real-time collaboration are further driving efficiency and enabling faster time-to-market for complex electronics products across the global market.

Keysight and Synopsys employ AI for RF design migration

Keysight RFCircuit Pro

Keysight has combined it Electromagnetic Simulator with Synopsys’ AI-powered RF design migration flow for an integrated design flow to migrate from TSMC’s N6RF+ to N4P process technology. The migration workflow builds on the foundry’s Analog Design Migration (ADM) methodology to streamline the redesign of passive devices and design components to the advanced RF process rules. The collaborative migration workflow leverages ...

Atlas suite marks MIPS’ drive to co-design

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For physical AI at the edge, MIPS has introduced the Atlas Explorer portfolio. The company explained that it allows designers cycle-accurate repeatability of their workload onto a MIPS processor. It provides access to platform IP ahead of silicon availability for evaluation to enable pre-production RTL and for teams to develop optimised hardware and concepts such as digital twins to gain ...

Siemens applies AI across chip and PCB design portfolio

Agentic and generative AI Siemens EDA portfolio

DAC 2025: There was a lot of talk about AI at this year’s DAC but one of the most significant was that Siemens Digital Industries Software has added generative and agentic AI capabilities across its EDA portfolio. The EDA AI system applies across all semiconductor and PCB design suites, including Questra, Tessent, Xpedition, Veloce, Catapult, Calibre, Aprisa and Solido.  “It ...

Translation tool tackles optimisation in large SoCs

Sam Appleton CEO Ausdia

Designers looking to optimise PPA (power, performance, area) are finding that optimisation engines can render original programmatic timing constraints unusable in their original form. At DAC 2025, Ausdia introduced Timevision OneSource which automatically generates a new version of block-level constraints after optimisation engines have worked on hierarchies, duplicate elements and performed advanced transformation. Such optimisations can save two weeks of ...

Switch fabric scales up data movement for AI  

DAC conference

San Francisco: At last year’s DAC, Baya Systems emerged from stealth mode. At this year’s event, the design software company announced a switch fabric technology that is claimed to enable a x100 increase in node density. NeuraScale is designed to overcome critical scaling and data movement challenges in AI infrastructure that are driving advanced SoCs and emerging 3D chiplet-based designs, ...

DAC 2026

DAC conference

DAC moves to Long Beach, southern California for 2026. The exhibition and conference covers chips to systems with education, exhibits, training and networking opportunities for designers, researchers, tool developers and vendors. It is of interest to system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives, and researchers and academicians from leading universities. The ...

Two software tools target efficient design of 2.5D and 3D ICs

Siemens 3D Thermal management

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025. The Innovator3D IC suite advances 3D IC integration using AI to execute chip design and raise productivity, as designers increasingly reintegrate chiplets into high performance substrates, said the company. It enables IC ...

DAC 2025

DAC 2025

An international conference and exhibition with presentations by approximately 200 of the leading and emerging companies in design tools and chip design. Keynotes, presentations and technical sessions cover : Artificial Intelligence/ Machine Learning (AI/ ML) Automotive Design Services Design on Cloud Electronic Design Automation (EDA) Embedded Systems and Software (ESS) Intellectual Property (IP) Security/Privacy The conference is sponsored by the ...

EW BrightSparks 2024 profile: Ethan Wilkinson, EDA Solutions / Birmingham University

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Now in its seventh year, the EW BrightSparks awards see Electronics Weekly highlight and celebrate some of the brightest and most talented young engineers in the UK today. Continuing our series on the latest EW BrightSparks of 2024, we profile Ethan Wilkinson, a UKESF Scholar who is an Engineering Student (MEng) at the University of Birmingham with an internship at ...